A polishing pad for surface planarization is made by impregnating a polyester-based fibrous fabric with thermosetting resins to form a porous impregnated material, and heating the porous impregnated material to effect changes in shape of the pores such that an integrally formed polishing pad with hard/soft layers of different hardnesses is obtained; the heated side of the polishing pad has high hardness and high cutting/grinding ability, whereas the unheated side maintains the original tiny pores and low hardness; and the polishing pad can produce a buffering effect when subjected to an external force and in turn apply an evenly distributed force to an article being polished.