Invention Application
- Patent Title: STACKED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 堆叠图像传感器及其制造方法
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Application No.: US15241660Application Date: 2016-08-19
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Publication No.: US20170053969A1Publication Date: 2017-02-23
- Inventor: Sookyoung ROH , Seokho YUN , Sunghyun NAM
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0116852 20150819
- Main IPC: H01L27/30
- IPC: H01L27/30 ; H01L31/028 ; H01L27/146 ; H01L51/44
Abstract:
A stacked image sensor and a method of manufacturing the same are provided. The stacked image sensor includes a lower photoelectric conversion layer, a micro-lens provided on the lower photoelectric conversion layer, and an upper photoelectric conversion layer provided on the micro-lens. The lower photoelectric conversion layer and the upper photoelectric conversion layer are different types of photoelectric conversion layers.
Public/Granted literature
- US10388701B2 Stacked image sensor and method of manufacturing the same Public/Granted day:2019-08-20
Information query
IPC分类:
