Invention Application
- Patent Title: MULTI-CHIP STRUCTURE HAVING FLEXIBLE INPUT/OUTPUT CHIPS
- Patent Title (中): 具有灵活输入/输出信号的多芯片结构
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Application No.: US15050473Application Date: 2016-02-23
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Publication No.: US20170054656A1Publication Date: 2017-02-23
- Inventor: Yan-Bin Luo , Hao-Hui Yin , Chih-Ching Yu , Yao-Chun Su
- Applicant: MEDIATEK INC.
- Main IPC: H04L12/931
- IPC: H04L12/931 ; H04L12/935
Abstract:
A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.
Public/Granted literature
- US10397142B2 Multi-chip structure having flexible input/output chips Public/Granted day:2019-08-27
Information query
