Invention Application
- Patent Title: THERMAL MANAGEMENT SYSTEM
- Patent Title (中): 热管理系统
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Application No.: US14848860Application Date: 2015-09-09
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Publication No.: US20170067693A1Publication Date: 2017-03-09
- Inventor: Brian Magann Rush , Naveenan Thiagarajan , Hendrik Pieter Jacobus De Bock
- Applicant: GENERAL ELECTRIC COMPANY
- Main IPC: F28D15/02
- IPC: F28D15/02

Abstract:
A thermal management system including a first vapor housing configured to receive a fluid that absorbs thermal energy from a first heat source, and a phase change material (PCM) housing thermally coupled to the first vapor housing, wherein the PCM housing is configured to receive a PCM that absorbs thermal energy from the first vapor housing, wherein the first vapor housing and the PCM housing are one-piece.
Public/Granted literature
- US10386127B2 Thermal management system Public/Granted day:2019-08-20
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