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公开(公告)号：US11804746B2
公开(公告)日：2023-10-31
申请号：US17007003
申请日：2020-08-31
Applicant: General Electric Company
Inventor： Karthik K. Bodla , Naveenan Thiagarajan , Mohamed Osama , John Russell Yagielski , David Allan Torrey , Vandana Prabhakar Rallabandi
Abstract: An electric machine can include a stator core having a plurality of core teeth that define a plurality of core slots in a surface thereof. A winding can be housed at least partially in the core slots. The winding can include a tube defining a channel through at least a portion thereof and one or more wires disposed along a surface of the tube that is opposite the channel. A cooling system can be operably coupled with the channel and configured to move a cooling fluid through the channel.
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公开(公告)号：US20200178941A1
公开(公告)日：2020-06-11
申请号：US16212863
申请日：2018-12-07
Applicant: General Electric Company
Inventor： Naveenan Thiagarajan , Warren Lee , Brian Magann Rush
Abstract: An ultrasound probe is presented. The ultrasound probe includes an ultrasound probe handle. Moreover, the ultrasound probe also includes a phase change chamber monolithic with respect to a portion of the ultrasound probe handle, where the phase change chamber includes hermetic chamber walls extending around and defining an enclosed chamber and a material disposed within the hermetic chamber walls, where the material is configured to change phase in response to heat from a component of the ultrasound probe.
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公开(公告)号：US20180367011A1
公开(公告)日：2018-12-20
申请号：US15624456
申请日：2017-06-15
Applicant: General Electric Company
Inventor： Karthik Kumar Bodla , Naveenan Thiagarajan , Patel Bhageerath Reddy , Yogen Vishwas Utturkar
CPC classification number: H02K9/04 , H02K3/24 , H02K15/024 , H02K15/10
Abstract: A method includes fabricating a core, wherein the core comprises a chemically soluble first polymer, forming a body around the core, wherein the body comprises a second polymer, and etching away the core to reveal a cooling channel extending through the body.
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公开(公告)号：US20170172542A1
公开(公告)日：2017-06-22
申请号：US14973739
申请日：2015-12-18
Applicant: General Electric Company
Inventor： Warren Lee , Naveenan Thiagarajan
CPC classification number: A61B8/4433 , A61B8/546 , A61B8/56 , H02J7/0027 , H02J7/0044 , H02J7/025 , H02J50/10
Abstract: A docking station for electrically charging and managing a thermal condition of an ultrasound probe is presented. The docking station includes a first charging unit magnetically coupled to an induction unit of the ultrasound probe and configured to charge at least one battery in the ultrasound probe. Further, the docking station includes a first cooling unit thermally coupled to a thermal unit of the ultrasound probe and configured to dissipate heat from the ultrasound probe.
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公开(公告)号：US20160169591A1
公开(公告)日：2016-06-16
申请号：US14570204
申请日：2014-12-15
Applicant: General Electric Company
IPC: F28D15/02
CPC classification number: F28D15/0275 , F28D15/02 , F28D15/04 , F28D20/02 , F28D2020/0008 , H01L23/34 , H01L23/4275 , H01M10/052 , H01M10/659 , Y02E60/145
Abstract: A system is disclosed. The system includes a thermally conductive enclosure bounding an interior cavity, a metallic cell wall structure disposed within the cavity, in thermal communication with the enclosure, and defining a plurality of cells, and a phase change material disposed within the cells and in thermal communication with the cell walls. The plurality of cells have a cell width less than about 5 millimeters, and the cell wall thickness of the cell wall structure is in a range from about 0.25 millimeter to about 1 millimeter.
Abstract translation: 公开了一种系统。 该系统包括界定内腔的导热外壳，设置在空腔内的金属电池壁结构，与外壳热连通，并且限定多个电池，以及设置在电池内并与电池内部热连通的相变材料 细胞壁。 多个电池具有小于约5毫米的电池宽度，电池壁结构的电池壁厚度在约0.25毫米至约1毫米的范围内。
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Patent Agency Ranking
公开(公告)号：US20230313782A1
公开(公告)日：2023-10-05
申请号：US18009088
申请日：2020-06-10
Applicant: General Electric Company
Inventor： Naveenan Thiagarajan , Andrew Maxwell Peter , Samir Salamah
IPC: F03D80/60
CPC classification number: F03D80/60 , F05B2260/221
Abstract: A multisiphon passive cooling system includes a heat exchanger thermally connected to a heat-generating component located within an enclosure, a distribution manifold located below the heat exchanger, a condensing unit located external to the enclosure and above the heat exchanger, and a first conduit thermally connected to the heat exchanger. The first conduit is fluidly connected to the distribution manifold and the condensing unit. The cooling system also includes a second conduit fluidly connected to the condensing unit and the distribution manifold, a liquid bridge fluidly connected to the first conduit and the second conduit or the distribution manifold, and a two-phase cooling medium that circulates through a loop defined by the first conduit, the liquid bridge, the condensing unit, the second conduit, the heat exchanger, and the distribution manifold. As such, the liquid bridge transfers the cooling medium in a liquid state from the first conduit to the second conduit or the distribution manifold.
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公开(公告)号：US10386127B2
公开(公告)日：2019-08-20
申请号：US14848860
申请日：2015-09-09
Applicant: GENERAL ELECTRIC COMPANY
Abstract: A thermal management system including a first vapor housing configured to receive a fluid that absorbs thermal energy from a first heat source, and a phase change material (PCM) housing thermally coupled to the first vapor housing, wherein the PCM housing is configured to receive a PCM that absorbs thermal energy from the first vapor housing, wherein the first vapor housing and the PCM housing are one-piece.
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8.发明申请公开(公告)号：US20180348070A1
公开(公告)日：2018-12-06
申请号：US15615576
申请日：2017-06-06
Applicant: General Electric Company
Inventor： Guanghua Wang , Nirm Velumylum Nirmalan , Mohamed Sakami , Thomas Charles Adcock , Jeffrey Jay Porubcan , James William Sears , Naveenan Thiagarajan , Bernard Bewlay , Jason Edward Dees , James DeLancey
CPC classification number: G01K13/02 , F01D21/003 , F02D2200/021 , F02D2200/0414 , F05D2270/8041 , G01F15/043 , G01K1/12 , G01K1/14 , G01K2013/024 , G01K2205/00 , G02B23/2492
Abstract: An imaging system includes a sight tube extending along a longitudinal axis of the imaging system and configured to extend through an access port. The sight tube includes a wall extending about the longitudinal axis and defining a cavity. The imaging system also includes a plurality of cooling channels extending through the sight tube. The plurality of cooling channels are configured to direct cooling fluid through the sight tube for cooling the imaging system. The plurality of cooling channels are formed in the sight tube such that at least one cooling channel of the plurality of cooling channels extends in a direction oblique to the longitudinal axis.
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公开(公告)号：US20180195906A1
公开(公告)日：2018-07-12
申请号：US15401886
申请日：2017-01-09
Applicant: General Electric Company
Inventor： Guanghua Wang , Jason Edward Dees , Scott Michael Oppenheimer , Naveenan Thiagarajan
IPC: G01J5/04 , G01J5/00 , H04N5/33 , H04N5/225 , G03B17/55 , H04N5/247 , H04N5/232 , F01D21/00 , F01D25/26
CPC classification number: G01J5/042 , F01D17/085 , F01D25/14 , F01D25/26 , G01J5/0014 , G01J5/0088 , G01J5/046 , G01J5/061 , G01J2005/0077 , G03B17/55 , H04N5/22521 , H04N5/23206 , H04N5/33 , Y02T50/671 , Y02T50/675
Abstract: An infrared imaging device includes a case, a plurality of electronic components, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the case. The heat transfer structure is disposed within the case. The heat transfer structure is configured to conduct heat away from the plurality of electronic components. The heat transfer structure is further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.
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公开(公告)号：US09913411B2
公开(公告)日：2018-03-06
申请号：US15139440
申请日：2016-04-27
Applicant: GENERAL ELECTRIC COMPANY
IPC: H05K7/20 , H01L23/473
CPC classification number: H05K7/20881 , H05K7/20336 , H05K7/20681
Abstract: A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.
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