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公开(公告)号：US20210365086A1
公开(公告)日：2021-11-25
申请号：US17394088
申请日：2021-08-04
摘要： A multi-domain cooling assembly configured to be coupled with one or more heat sources includes a body having an outer surface and at least one cooling chamber disposed inside the body. The at least one cooling chamber extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources. The assembly includes a cooling channel disposed within the body and fluidly coupled with a passageway that carries cooling fluid into and out of the cooling channel. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel is fluidly separate from the at least one cooling chamber. The cooling channel is thermally coupled with the at least one cooling chamber. The at least one cooling chamber transfers thermal energy from the working fluid to the cooling fluid.
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公开(公告)号：US20170123103A1
公开(公告)日：2017-05-04
申请号：US14932732
申请日：2015-11-04
发明人： Loucas Tsakalakos , Slawomir Rubinsztajn , Renato Guida , Mahadevan Balasubramaniam , Boon Kwee Lee , Brian Magann Rush , Faisal Razi Ahmad , Sudeep Mandal , David Sirda Shanks
CPC分类号： G01V9/005 , E21B47/06 , E21B47/1005 , G01F1/6884 , G01F1/74 , G01N9/04 , G01N25/00 , G01N27/02
摘要： A fluid sensor cable assembly and method uses one or more conductive bodies extending along an elongated core body for conducting a heating current to heat the cable assembly. The one or more conductive bodies also are configured to conduct an interrogation signal and to conduct reflections of the interrogation signal. One or more optical fibers extend along the length of the core body and include temperature sensitive elements at different locations along the length of the core body. The temperature sensitive elements measure heat flux out of the cable assembly at the different locations subsequent to heating the cable assembly and communicate the heat flux to a computer acquisition system.
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公开(公告)号：US20170067693A1
公开(公告)日：2017-03-09
申请号：US14848860
申请日：2015-09-09
IPC分类号： F28D15/02
CPC分类号： F28F7/02 , F28D15/0266 , F28D15/046 , F28D20/02 , F28D2020/0013 , F28F2210/02 , F28F2215/06 , H01L23/427 , H05K7/20 , H05K7/20309 , H05K7/20318 , Y02E60/145
摘要： A thermal management system including a first vapor housing configured to receive a fluid that absorbs thermal energy from a first heat source, and a phase change material (PCM) housing thermally coupled to the first vapor housing, wherein the PCM housing is configured to receive a PCM that absorbs thermal energy from the first vapor housing, wherein the first vapor housing and the PCM housing are one-piece.
摘要翻译： 一种热管理系统，包括构造成接收从第一热源吸收热能的流体的第一蒸汽壳体，以及热耦合到第一蒸气壳体的相变材料（PCM）壳体，其中PCM壳体构造成接收 PCM，其从第一蒸汽壳体吸收热能，其中第一蒸汽壳体和PCM壳体是一体的。
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公开(公告)号：US20160338221A1
公开(公告)日：2016-11-17
申请号：US14711405
申请日：2015-05-13
发明人： Brian Magann Rush , Joo Han Kim
CPC分类号： B60L15/007 , H02M1/00 , H05K7/20936 , Y02T10/645
摘要： A system and method are provided for passively cooling an inverter subsystem within an enclosure. The method and system absorb heat generated by an inverter subsystem within an enclosure through a first heat spreader. The first heat spreader is thermally coupled to in the inverter subsystem and a first interior surface of the enclosure. The system and method transfer a portion of the heat from the first heat spreader to a second heat spreader through a plurality of heat pipes. The plurality of heat pipes are thermally coupled to the first heat spreader and the second heat spreader. The system and method further thermally couple the second heat spreader to a second interior surface of the enclosure.
摘要翻译： 提供了一种用于被动地冷却外壳内的逆变器子系统的系统和方法。 该方法和系统通过第一散热器吸收外壳内的逆变器子系统产生的热量。 第一散热器热连接到逆变器子系统和外壳的第一内表面。 该系统和方法通过多个热管将一部分热量从第一散热器传递到第二散热器。 多个热管热耦合到第一散热器和第二散热器。 该系统和方法进一步将第二散热器热耦合到外壳的第二内表面。
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公开(公告)号：US20210156339A1
公开(公告)日：2021-05-27
申请号：US16698287
申请日：2019-11-27
摘要： A cooling system includes a conduit extending from an upstream end to a downstream end and retains a gas. A heat exchanger is fluidly coupled with and disposed within a surface of the conduit. A portion of the gas is directed into the heat exchanger via one or more passages extending between the conduit and the heat exchanger, and a portion of the gas is directed out of the heat exchanger via the one or more passages. The heat exchanger directs cooling fluid in one or more directions within the heat exchanger along one or more passageways of plural passageways. The heat exchanger directs the portion of the gas in one or more directions within the heat exchanger along one or more other passageways of the plural passageways. The heat exchanger cools the gas by exchanging heat from the gas to the cooling fluid within the heat exchanger.
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公开(公告)号：US20210147061A1
公开(公告)日：2021-05-20
申请号：US16685527
申请日：2019-11-15
发明人： Nicholas William Rathay , Brian Magann Rush , Narendra Digamber Joshi , Timothy John Sommerer , Gregory Alexander Natsui , Brian Gene Brzek , Douglas Carl Hofer
摘要： A hypersonic aircraft includes one or more leading edge assemblies that are designed to cool the leading edge of certain portions of the hypersonic aircraft that are exposed to high thermal loads, such as extremely high temperatures and/or thermal gradients. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. A coolant supply provides a flow of cooling fluid to a porous tip that is joined to the forward end of the outer wall and defines variable porosity and/or internal barriers to direct a flow of cooling fluid to the regions of the leading edge experiencing the highest thermal loading.
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公开(公告)号：US10802467B2
公开(公告)日：2020-10-13
申请号：US15399935
申请日：2017-01-06
IPC分类号： G05B19/4097 , B29C64/393 , B33Y50/02 , G06F30/00
摘要： The present disclosure provides methods of defining internal secondary structures of an object to be formed at least in part by additive manufacturing. The object may include a primary structure having a volume. The methods may include applying a balancing parameter within an axis-aligned bounding box that encompasses the primary structure. The methods may further include refining the balancing parameter until the volume is delimited into a plurality of the internal structures. The plurality of internal structures may be oriented at an angle to a global z-axis that is substantially parallel to a build direction, such as angled in a range of 40 degrees to 70 degrees to the z-axis.
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公开(公告)号：US20200178941A1
公开(公告)日：2020-06-11
申请号：US16212863
申请日：2018-12-07
摘要： An ultrasound probe is presented. The ultrasound probe includes an ultrasound probe handle. Moreover, the ultrasound probe also includes a phase change chamber monolithic with respect to a portion of the ultrasound probe handle, where the phase change chamber includes hermetic chamber walls extending around and defining an enclosed chamber and a material disposed within the hermetic chamber walls, where the material is configured to change phase in response to heat from a component of the ultrasound probe.
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公开(公告)号：US10660236B2
公开(公告)日：2020-05-19
申请号：US14592387
申请日：2015-01-08
发明人： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
摘要： According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
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公开(公告)号：US20180049307A1
公开(公告)日：2018-02-15
申请号：US15237054
申请日：2016-08-15
CPC分类号： H05K1/0203 , H05K5/0256 , H05K7/20309 , H05K7/2039 , H05K7/20672
摘要： An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.
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