Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US15215849Application Date: 2016-07-21
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Publication No.: US20170094773A1Publication Date: 2017-03-30
- Inventor: Il-Jong SEO , Ogura ICHIRO , Myung-Sam KANG , Tae-Hong MIN
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2015-0136825 20150925
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/40 ; H05K3/46
Abstract:
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board may include a core layer, a metal layer disposed on the core layer, and a heat dissipation unit disposed to pass through the core layer in across a thickness of the core layer.
Information query
