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1.发明申请PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开印刷电路板，半导体封装及其制造方法公开(公告)号：US20160225706A1
公开(公告)日：2016-08-04
申请号：US15008247
申请日：2016-01-27
发明人： Jung-Hyun CHO , Young-Gwan KO , Il-Jong SEO , Yong-Ho BAEK
IPC分类号： H01L23/498 , H01L21/48 , H01L21/683 , H01L23/00
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/13 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2224/03828 , H01L2224/10175 , H01L2224/11334 , H01L2224/13017 , H01L2224/13019 , H01L2224/131 , H01L2224/13294 , H01L2224/133 , H01L2224/16237 , H01L2224/81024 , H01L2224/81191 , H01L2224/81193 , H01L2224/81385 , H01L2224/81395 , H01L2224/814 , H01L2224/81411 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/8149 , H01L2224/81815 , H01L2224/92 , H01L2924/3512 , H01L2924/381 , H01L2924/3841 , H01L2924/014 , H01L2924/00014
摘要： A printed circuit board, a semiconductor package and a method of manufacturing the same are provided. The printed circuit board includes a circuit layer including a buried pad embedded on an upper surface of an insulating layer, and a groove part disposed in the buried pad.
摘要翻译： 提供一种印刷电路板，半导体封装及其制造方法。 印刷电路板包括电路层，该电路层包括嵌入在绝缘层的上表面上的掩埋焊盘以及设置在掩埋焊盘中的槽部。
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公开(公告)号：US20170094773A1
公开(公告)日：2017-03-30
申请号：US15215849
申请日：2016-07-21
发明人： Il-Jong SEO , Ogura ICHIRO , Myung-Sam KANG , Tae-Hong MIN
CPC分类号： H05K1/0206 , H05K1/0207 , H05K1/115 , H05K3/4038 , H05K3/4602 , H05K3/4644 , H05K2201/0338 , H05K2201/049 , H05K2201/06 , H05K2201/09536 , H05K2201/09609 , H05K2201/09645 , H05K2201/10674
摘要： A printed circuit board and a method of manufacturing the same are provided. The printed circuit board may include a core layer, a metal layer disposed on the core layer, and a heat dissipation unit disposed to pass through the core layer in across a thickness of the core layer.
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公开(公告)号：US20170086299A1
公开(公告)日：2017-03-23
申请号：US15092043
申请日：2016-04-06
发明人： Myung-Sam KANG , Sam-Dae PARK , Tae-Hong MIN , Il-Jong SEO , Young-Gwan KO
IPC分类号： H05K1/18 , H05K1/02 , H05K1/11 , H05K3/46 , H05K3/06 , H01G4/008 , H01G4/12 , H05K3/40 , H05K1/03 , H05K1/09
CPC分类号： H01G4/1227 , H01G2/10 , H01G4/008 , H01G4/0085 , H01G4/232 , H01G4/30 , H01G4/33 , H05K1/162 , H05K3/4605 , H05K3/4629 , H05K3/4688 , H05K2201/096
摘要： A printed circuit board and a method for manufacturing the same are provided. A printed circuit board according to an example includes a core formed by laminating dielectric substance layers; a capacitor including an internal electrode layer formed between the dielectric substance layers which are adjacent with each other and a connection via alternately connecting the internal electrode layers which are adjacent with each other to provide an electric charge having a different polarity to the internal electrode layers which are adjacent with each other and formed on the core; and a through via passing through the core.
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公开(公告)号：US20160381796A1
公开(公告)日：2016-12-29
申请号：US15096993
申请日：2016-04-12
发明人： Sung-Uk LEE , Il-Jong SEO , Jae-Hoon CHOI , Yong-Ho BAEK
CPC分类号： H05K1/115 , H05K3/067 , H05K3/4647 , H05K3/4682 , H05K3/4697 , H05K2201/0361 , H05K2201/09854 , H05K2203/0369 , H05K2203/0376 , H05K2203/0384
摘要： A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.
摘要翻译： 提供印刷电路板和制造印刷电路板的方法。 印刷电路板包括绝缘层，嵌入绝缘层中的电路层，设置在绝缘层的一个表面上的阻焊层，阻焊层具有通孔形状的空腔，以暴露部分 电路层，以及嵌入到阻焊层中并经由阻焊层的开口暴露于外部的金属柱，金属柱包括第一后金属层，后阻挡层和第二柱 金属层。
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