-
公开(公告)号：US20160192471A1
公开(公告)日：2016-06-30
申请号：US14981378
申请日：2015-12-28
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong MIN , Myung-Sam KANG , Young-Gwan KO , Min-Jae SEONG
CPC classification number: H05K3/4602 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2924/15311 , H01L2924/3511 , H05K1/0203 , H05K1/0206 , H05K1/0207 , H05K1/181 , H05K1/185
Abstract: A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.
Abstract translation: 公开了一种电路板及其制造方法。 电路板包括绝缘部分，包括第一结构和第二结构的导热结构，以及被配置为使第一结构与第二结构绝缘的绝缘体，其中第一结构和第二结构由导热材料构成， 并且所述导热结构的至少一部分被插入所述绝缘部。
-
公开(公告)号：US20170094773A1
公开(公告)日：2017-03-30
申请号：US15215849
申请日：2016-07-21
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Il-Jong SEO , Ogura ICHIRO , Myung-Sam KANG , Tae-Hong MIN
CPC classification number: H05K1/0206 , H05K1/0207 , H05K1/115 , H05K3/4038 , H05K3/4602 , H05K3/4644 , H05K2201/0338 , H05K2201/049 , H05K2201/06 , H05K2201/09536 , H05K2201/09609 , H05K2201/09645 , H05K2201/10674
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board may include a core layer, a metal layer disposed on the core layer, and a heat dissipation unit disposed to pass through the core layer in across a thickness of the core layer.
-
公开(公告)号：US20200178401A1
公开(公告)日：2020-06-04
申请号：US16676493
申请日：2019-11-07
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong MIN , Ju-Ho KIM
Abstract: A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.
-
公开(公告)号：US20190139696A1
公开(公告)日：2019-05-09
申请号：US16233178
申请日：2018-12-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： In-Seok KIM , Yong-Jin PARK , Young-Gwan KO , Youn-Soo SEO , Myung-Sam KANG , Tae-Hong MIN
IPC: H01F27/32 , H01F41/04 , H01F27/255 , H01F17/00
Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.
-
公开(公告)号：US20160249445A1
公开(公告)日：2016-08-25
申请号：US15050606
申请日：2016-02-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae-Hong MIN , Myung-Sam KANG , Jung-Han LEE , Young-Gwan KO
CPC classification number: H05K1/0206 , H05K1/0203 , H05K1/0204 , H05K1/0207 , H05K1/0218 , H05K1/111 , H05K1/181 , H05K1/183 , H05K3/4608 , H05K2201/0323 , H05K2201/0338 , H05K2201/066 , H05K2201/10416
Abstract: A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.
Abstract translation: 公开了一种电路板。 除了绝缘层之外，电路板还包括用于传热的结构，其包括由石墨或石墨烯形成的第一层，由金属材料形成并设置在第一层的一个表面上的第二层，以及第三层 层，其由金属材料形成并且设置在第一层的另一表面上，并且用于传热的结构的至少一部分插入绝缘层中。 这种电路板提供改进的热管理。 还公开了一种制造电路板的方法。
-
Patent Agency Ranking
公开(公告)号：US20200178389A1
公开(公告)日：2020-06-04
申请号：US16674460
申请日：2019-11-05
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong MIN , Ju-Ho KIM
Abstract: A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.
-
公开(公告)号：US20200163228A1
公开(公告)日：2020-05-21
申请号：US16664113
申请日：2019-10-25
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sa-Yong LEE , Tae-Hong MIN
IPC: H05K3/36 , H05K1/18 , H01L23/498
Abstract: A printed circuit board includes: an insulating material; a metal layer disposed on a first surface of the insulating material and including an opening; a pad disposed along a second surface of the insulating material; a via hole penetrating through the insulating material and extending from the pad to the opening; and a conductor disposed along the opening and the via hole. A diameter of a portion of the via hole adjacent to the opening is smaller than a diameter of a portion of the opening adjacent to the via hole.
-
公开(公告)号：US20170251548A1
公开(公告)日：2017-08-31
申请号：US15594085
申请日：2017-05-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae-Hong MIN , Myung-Sam KANG , Jung-Han LEE , Young-Gwan KO
CPC classification number: H05K1/0206 , H05K1/0203 , H05K1/0204 , H05K1/0207 , H05K1/0218 , H05K1/111 , H05K1/181 , H05K1/183 , H05K3/4608 , H05K2201/0323 , H05K2201/0338 , H05K2201/066 , H05K2201/10416
Abstract: A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.
-
9.发明申请CIRCUIT BOARD, MULTILAYERED SUBSTRATE HAVING THE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD 审中-公开电路板，具有电路板的多层基板和制造电路板的方法公开(公告)号：US20160192488A1
公开(公告)日：2016-06-30
申请号：US14962428
申请日：2015-12-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae-Hong MIN , Myung-Sam KANG , Jung-Han LEE , Young-Gwan KO
CPC classification number: H05K1/115 , H05K1/0212 , H05K3/0017 , H05K3/0047 , H05K2201/09854 , H05K2201/10378
Abstract: Disclosed is a circuit board that includes a core portion having a first via disposed therein in the general shape of an hourglass. The circuit board implements a finer via that penetrates a core and improves heat dissipation performance. The circuit board includes a core portion including a first core and a second core made of a metallic material, the first core and the second core being disposed adjacent to each other, and a first via penetrating the core portion.
Abstract translation: 公开了一种电路板，其包括具有以沙漏的大致形状设置在其中的第一通孔的芯部。 电路板实现了更细的通孔，穿透芯体并提高散热性能。 电路板包括：芯部，包括第一芯和由金属材料制成的第二芯，第一芯和第二芯彼此相邻设置，第一通孔穿透芯部。
-
公开(公告)号：US20160143129A1
公开(公告)日：2016-05-19
申请号：US14938900
申请日：2015-11-12
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong MIN , Myung-Sam KANG , Young-Gwan KO
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2924/15311 , H05K1/0203 , H05K1/0207 , H05K1/0231 , H05K1/185 , H05K3/445 , H05K3/4602 , H05K3/4608 , H05K2201/0323 , H05K2201/09136 , H05K2201/10015 , H05K2201/10416 , H05K2201/10636 , Y02P70/611
Abstract: A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.
Abstract translation: 电路板包括包括腔或凹部的第一导热结构。 第一导热结构的至少一部分插入到绝缘部分中。 一种电子设备，包括其部分插入空腔或凹部中。
-
-
-
-
-
-
-
-
-
Search Results
15
records
(took 0.023 seconds)
