Invention Application
- Patent Title: ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
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Application No.: US15242437Application Date: 2016-08-19
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Publication No.: US20170101310A1Publication Date: 2017-04-13
- Inventor: Aaron Partridge , Markus Lutz , Pavan Gupta
- Applicant: SiTime Corporation
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00
Abstract:
After forming a microelectromechanical-system (MEMS) resonator within a silicon-on-insulator (SOI) wafer, a complementary metal oxide semiconductor (CMOS) cover wafer is bonded to the SOI wafer via one or more eutectic solder bonds that implement respective paths of electrical conductivity between the two wafers and hermetically seal the MEMS resonator within a chamber.
Public/Granted literature
- US09758371B2 Encapsulated microelectromechanical structure Public/Granted day:2017-09-12
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