中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

34 records (took 0.025 seconds)

    Stacked-die MEMS resonator
    2.
    发明授权
    Stacked-die MEMS resonator 有权

    公开(公告)号：US11370656B2

    公开(公告)日：2022-06-28

    申请号：US17143119

    申请日：2021-01-06

    Applicant: SiTime Corporation

    Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

    IPC: B81B7/00 ,  B81C1/00 ,  H01L41/113 ,  H01L23/34 ,  H01L23/498 ,  H01L23/31

    Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

    LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
    7.
    发明申请
    LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM 有权
    低剖面堆叠式MEMS谐振器系统

    公开(公告)号：US20150123220A1

    公开(公告)日：2015-05-07

    申请号：US14597825

    申请日：2015-01-15

    Applicant: SiTime Corporation

    Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

    Abstract translation: 用于微机电系统（MEMS）谐振器系统的薄型封装结构包括电引线，其在封装结构的横截面轮廓内的相应的第一和第二高度处具有内部和外部电接触表面，并且模具安装表面 第一和第二高度之间的中间高度。 谐振器控制芯片安装到电引线的管芯安装表面，使得谐振器控制芯片的至少一部分设置在第一和第二高度之间并且引线接合到电气的内部电接触表面 铅。 MEMS谐振器芯片以堆叠的管芯配置安装到谐振器控制芯片，并且电机的谐振器芯片，谐振器控制芯片和内部电接触和管芯安装表面被封装在暴露外部的封装外壳内 电气引线的电接触表面在包装结构的外表面。

Patent Agency Ranking