- 专利标题： Semiconductor Package
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申请号： US15403409申请日： 2017-01-11
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公开(公告)号： US20170125377A1公开(公告)日： 2017-05-04
- 发明人: Iou Ming Lou
- 申请人： CHENGWEI WU
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/498 ; H01L25/00 ; H01L23/00 ; H01L23/31 ; H01L23/538 ; H01L23/522 ; H01L25/11
摘要：
A semiconductor device is disclosed. The semiconductor device comprises a first die, a second die, and a redistribution structure. The first die and the second die are electrically connected to the redistribution structure. There are no solder bumps between the first die and the redistribution structure. There are no solder bumps between the second die and the redistribution structure. The first die and the second die have a shift with regard to each other from a top view.
公开/授权文献
- US09887176B2 Semiconductor package 公开/授权日：2018-02-06
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