专利检索 ap:"CHENGWEI WU" 第 1 页

1.

发明授权
Semiconductor package 有权

公开(公告)号：US09887176B2

公开(公告)日：2018-02-06

申请号：US15403409

申请日：2017-01-11

申请人： Chengwei Wu

发明人： Iou Ming Lou

IPC分类号： H01L25/00 , H01L25/065 , H01L23/522 , H01L23/498 , H01L25/11 , H01L23/00 , H01L23/31 , H01L23/538

CPC分类号： H01L25/0652 , H01L21/568 , H01L23/13 , H01L23/3114 , H01L23/3128 , H01L23/3192 , H01L23/49816 , H01L23/49838 , H01L23/5226 , H01L23/5384 , H01L23/5385 , H01L24/02 , H01L24/05 , H01L24/08 , H01L24/09 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/18 , H01L25/50 , H01L2224/023 , H01L2224/02331 , H01L2224/0401 , H01L2224/05018 , H01L2224/05026 , H01L2224/05082 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05173 , H01L2224/05183 , H01L2224/05548 , H01L2224/05558 , H01L2224/05559 , H01L2224/05567 , H01L2224/05569 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/06051 , H01L2224/08225 , H01L2224/1184 , H01L2224/12105 , H01L2224/13005 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13553 , H01L2224/13582 , H01L2224/16141 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/19 , H01L2224/2101 , H01L2224/221 , H01L2224/24135 , H01L2224/24137 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73209 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/81193 , H01L2224/81895 , H01L2224/92244 , H01L2225/0651 , H01L2225/0652 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/07025 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/014 , H01L2924/00012 , H01L2924/01074 , H01L2924/01023 , H01L2924/00 , H01L2224/83005 , H01L2224/45099

摘要： A semiconductor device is disclosed. The semiconductor device comprises a first die, a second die, and a redistribution structure. The first die and the second die are electrically connected to the redistribution structure. There are no solder bumps between the first die and the redistribution structure. There are no solder bumps between the second die and the redistribution structure. The first die and the second die have a shift with regard to each other from a top view.

2.

发明申请
SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装

公开(公告)号：US20160155723A1

公开(公告)日：2016-06-02

申请号：US14952920

申请日：2015-11-26

申请人： Chengwei WU

发明人： Iou Ming Lou

IPC分类号： H01L25/065 , H01L25/18 , H01L23/528 , H01L23/31 , H01L23/00 , H01L23/522

CPC分类号： H01L25/0652 , H01L21/568 , H01L23/13 , H01L23/3114 , H01L23/3128 , H01L23/3192 , H01L23/49816 , H01L23/49838 , H01L23/5226 , H01L23/5384 , H01L23/5385 , H01L24/02 , H01L24/05 , H01L24/08 , H01L24/09 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/18 , H01L25/50 , H01L2224/023 , H01L2224/02331 , H01L2224/0401 , H01L2224/05018 , H01L2224/05026 , H01L2224/05082 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05173 , H01L2224/05183 , H01L2224/05548 , H01L2224/05558 , H01L2224/05559 , H01L2224/05567 , H01L2224/05569 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/06051 , H01L2224/08225 , H01L2224/1184 , H01L2224/12105 , H01L2224/13005 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13553 , H01L2224/13582 , H01L2224/16141 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/19 , H01L2224/2101 , H01L2224/221 , H01L2224/24135 , H01L2224/24137 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73209 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/81193 , H01L2224/81895 , H01L2224/92244 , H01L2225/0651 , H01L2225/0652 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/07025 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/014 , H01L2924/00012 , H01L2924/01074 , H01L2924/01023 , H01L2924/00 , H01L2224/83005 , H01L2224/45099

摘要： A semiconductor device is disclosed. The semiconductor device comprises a die, a redistribution structure, and a plurality of metal posts. The redistribution structure comprises a first sublayer, a second sublayer, and a third sublayer. The first sublayer comprises a plurality of first metal traces with a first trace thickness A. The third sublayer comprises a plurality of third metal traces with a third trace thickness C. The first trace thickness A is smaller than the third trace thickness C.

摘要翻译： 公开了一种半导体器件。半导体器件包括管芯，再分布结构和多个金属柱。再分配结构包括第一子层，第二子层和第三子层。第一子层包括具有第一迹线厚度A的多个第一金属迹线。第三子层包括具有第三迹线厚度C的多个第三金属迹线。第一迹线厚度A小于第三迹线厚度C.

3.

发明授权
Semiconductor package 有权

公开(公告)号：US10957662B2

公开(公告)日：2021-03-23

申请号：US16705751

申请日：2019-12-06

申请人： Chengwei Wu

发明人： Chengwei Wu

IPC分类号： H01L23/00 , H01L23/498 , H01L25/10 , H01L25/18 , H01L23/13 , H01L23/31

摘要： A semiconductor device is disclosed. The semiconductor device comprises a redistribution structure, a processor die, and a metal post. The metal post has a first end, and a second end. The metal post is connected to the redistribution structure at the first end. The first end has a first width. The second end has a second width. The metal post has a waist width. The first width is greater than the waist width. The second width is greater than the waist width. The metal post has a side surface. The side surface is inwardly curved or outwardly curved.

4.

发明授权
Semiconductor package 有权

公开(公告)号：US10541217B2

公开(公告)日：2020-01-21

申请号：US16118710

申请日：2018-08-31

申请人： Chengwei Wu

发明人： Chengwei Wu

IPC分类号： H01L23/00 , H01L23/498 , H01L25/18 , H01L23/13 , H01L23/31

摘要： A semiconductor device is disclosed. The semiconductor device comprises a redistribution structure, a processor die, and a metal post. The metal post has a first end, and a second end. The metal post is connected to the redistribution structure at the first end. The first end has a first width. The second end has a second width. The metal post has a waist width. The first width is greater than the waist width. The second width is greater than the waist width. The metal post has a side surface. The side surface is inwardly curved or outwardly curved.

5.

发明申请
Semiconductor Package 有权

公开(公告)号：US20210167027A1

公开(公告)日：2021-06-03

申请号：US17176574

申请日：2021-02-16

申请人： Chengwei Wu

发明人： Chengwei Wu

IPC分类号： H01L23/00 , H01L25/18 , H01L23/498 , H01L23/13 , H01L25/10 , H01L23/31

摘要： A semiconductor device is disclosed. The semiconductor device comprises a redistribution structure, a processor die, and a metal post. The metal post has a first end, and a second end. The metal post is connected to the redistribution structure at the first end. The first end has a first width. The second end has a second width. The metal post has a waist width. The first width is greater than the waist width. The second width is greater than the waist width. The metal post has a side surface. The side surface is inwardly curved or outwardly curved.

6.

发明授权
Semiconductor package 有权

公开(公告)号：US10600757B2

公开(公告)日：2020-03-24

申请号：US16298173

申请日：2019-03-11

申请人： Chengwei Wu

发明人： Iou Ming Lou

IPC分类号： H01L23/00 , H01L25/065 , H01L23/522 , H01L25/18 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/10 , H01L25/11 , H01L25/00 , H01L21/56 , H01L23/13

摘要： A semiconductor device is disclosed. The semiconductor device comprises a first die, a second die, and a redistribution structure. The first die and the second die are electrically connected to the redistribution structure. There are no solder bumps between the first die and the redistribution structure. There are no solder bumps between the second die and the redistribution structure. The first die and the second die have a shift with regard to each other from a top view.

7.

发明授权
Semiconductor package 有权

公开(公告)号：US10269765B2

公开(公告)日：2019-04-23

申请号：US15850403

申请日：2017-12-21

申请人： Chengwei Wu

发明人： Iou Ming Lou

IPC分类号： H01L25/065 , H01L23/522 , H01L25/18 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/10 , H01L23/00 , H01L25/11 , H01L25/00 , H01L21/56 , H01L23/13

摘要： A semiconductor device is disclosed. The semiconductor device comprises a first die, a second die, and a redistribution structure. The first die and the second die are electrically connected to the redistribution structure. There are no solder bumps between the first die and the redistribution structure. There are no solder bumps between the second die and the redistribution structure. The first die and the second die have a shift with regard to each other from a top view.

8.

发明申请
Semiconductor Package 审中-公开

公开(公告)号：US20180114774A1

公开(公告)日：2018-04-26

申请号：US15850403

申请日：2017-12-21

申请人： CHENGWEI WU

发明人： Iou Ming Lou

IPC分类号： H01L25/065 , H01L23/31 , H01L23/498 , H01L23/522 , H01L23/538 , H01L25/00 , H01L23/00 , H01L25/11

CPC分类号： H01L25/0652 , H01L21/568 , H01L23/13 , H01L23/3114 , H01L23/3128 , H01L23/3192 , H01L23/49816 , H01L23/49838 , H01L23/5226 , H01L23/5384 , H01L23/5385 , H01L24/02 , H01L24/05 , H01L24/08 , H01L24/09 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/117 , H01L25/18 , H01L25/50 , H01L2224/023 , H01L2224/02331 , H01L2224/0401 , H01L2224/05018 , H01L2224/05026 , H01L2224/05082 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05173 , H01L2224/05183 , H01L2224/05548 , H01L2224/05558 , H01L2224/05559 , H01L2224/05567 , H01L2224/05569 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/06051 , H01L2224/08225 , H01L2224/1184 , H01L2224/12105 , H01L2224/13005 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13553 , H01L2224/13582 , H01L2224/16141 , H01L2224/16145 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/19 , H01L2224/2101 , H01L2224/221 , H01L2224/24135 , H01L2224/24137 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73209 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/81193 , H01L2224/81895 , H01L2224/92244 , H01L2225/0651 , H01L2225/0652 , H01L2225/06568 , H01L2225/1023 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/07025 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/014 , H01L2924/00012 , H01L2924/01074 , H01L2924/01023 , H01L2924/00 , H01L2224/83005 , H01L2224/45099

摘要： A semiconductor device is disclosed. The semiconductor device comprises a first die, a second die, and a redistribution structure. The first die and the second die are electrically connected to the redistribution structure. There are no solder bumps between the first die and the redistribution structure. There are no solder bumps between the second die and the redistribution structure. The first die and the second die have a shift with regard to each other from a top view.

9.

发明申请
Semiconductor Package 审中-公开

公开(公告)号：US20180061787A1

公开(公告)日：2018-03-01

申请号：US15676019

申请日：2017-08-14

申请人： Chengwei Wu

发明人： Chengwei Wu

IPC分类号： H01L23/00 , H01L23/498 , H01L23/31 , H01L25/18

CPC分类号： H01L24/02 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/17 , H01L25/18 , H01L2224/02331 , H01L2224/02373 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0401 , H01L2224/13022 , H01L2224/13024 , H01L2224/13101 , H01L2224/16225 , H01L2224/73204 , H01L2924/15311 , H01L2924/014 , H01L2924/00014

摘要： A semiconductor device is disclosed. The semiconductor device comprises a redistribution structure, a processor die, and a metal post. The metal post has a first end, and a second end. The metal post is connected to the redistribution structure at the first end. The first end has a first width. The second end has a second width. The metal post has a waist width. The first width is greater than the waist width. The second width is greater than the waist width. The metal post has a side surface. The side surface is inwardly curved or outwardly curved.