- 专利标题: WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
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申请号: US15416206申请日: 2017-01-26
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公开(公告)号: US20170129775A1公开(公告)日: 2017-05-11
- 发明人: Buu Q. Diep , Adam M. Kennedy , Thomas Allan Kocian , Mark Lamb
- 申请人: Raytheon Company
- 主分类号: B81B7/00
- IPC分类号: B81B7/00 ; B81C1/00
摘要:
A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.
公开/授权文献
- US09969610B2 Wafer level MEMS package including dual seal ring 公开/授权日:2018-05-15
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