公开(公告)号：US20160376146A1

公开(公告)日：2016-12-29

申请号：US14748482

申请日：2015-06-24

Applicant: Raytheon Company

Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

Abstract translation: 微机电系统（MEMS）封装包括在第一对外边缘之间延伸以限定长度的基板和限定宽度的第二对外边缘。 密封环组件设置在基板上，并且包括至少一个密封环，其形成与至少一个MEMS装置相邻的第一边界点和邻近至少一个外边缘的第二边界点。 封装还包括在密封环组件上的窗口盖，以限定包含至少一个MEMS器件的密封间隙。 密封圈组件在第二边界点将窗口盖固定到基底，使得窗口盖进入密封间隙的偏转减小。

公开(公告)号：US09969610B2

公开(公告)日：2018-05-15

申请号：US15416206

申请日：2017-01-26

Applicant: Raytheon Company

Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

IPC: H01L31/0203 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

公开(公告)号：US09771258B2

公开(公告)日：2017-09-26

申请号：US14748482

申请日：2015-06-24

Applicant: Raytheon Company

Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

IPC: H01L23/498 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

公开(公告)号：US20170129775A1

公开(公告)日：2017-05-11

申请号：US15416206

申请日：2017-01-26

Applicant: Raytheon Company

Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.