Invention Application
- Patent Title: METHOD FOR SEPARATING REGIONS OF A SEMICONDUCTOR LAYER
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Application No.: US15413281Application Date: 2017-01-23
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Publication No.: US20170133555A1Publication Date: 2017-05-11
- Inventor: Lorenzo ZINI , Bernd BOEHM
- Applicant: OSRAM Opto Semiconductors GmbH
- Priority: DE102012217524.5 20120927; DE102012220909.3 20121115
- Main IPC: H01L33/24
- IPC: H01L33/24 ; H01L33/00 ; H01L33/32 ; H01L25/075

Abstract:
The invention relates to a method for separating regions of a semiconductor layer and for introducing an outcoupling structure into an upper side of the semiconductor layer, the outcoupling structure being provided to couple light out of the semiconductor layer. The upper side of the semiconductor layer is covered by a mask having first openings for introducing the outcoupling structure and at least a second opening, which is provided to introduce a separating trench into the semiconductor layer. With the aid of an etching method, the outcoupling structure is introduced into the upper side of the semiconductor layer in the region of the first openings and simultaneously a separating trench passing through the semiconductor layer is introduced into the semiconductor layer via the second opening, and a region of the semiconductor layer is separated.
Public/Granted literature
- US09865776B2 Method for separating regions of a semiconductor layer Public/Granted day:2018-01-09
Information query
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