Invention Application
- Patent Title: OPTICAL DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US14939331Application Date: 2015-11-12
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Publication No.: US20170138566A1Publication Date: 2017-05-18
- Inventor: Hsin-Ying HO , Hsun-Wei CHAN , Lu-Ming LAI , Shih-Chieh TANG
- Applicant: Advanced Semiconductor Engineering, Inc.
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Main IPC: F21V7/04
- IPC: F21V7/04 ; F21V7/22 ; F21V23/00

Abstract:
In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.
Public/Granted literature
- US10862014B2 Optical device package and method of manufacturing the same Public/Granted day:2020-12-08
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