Invention Grant
- Patent Title: Optical device package and method of manufacturing the same
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Application No.: US14939331Application Date: 2015-11-12
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Publication No.: US10862014B2Publication Date: 2020-12-08
- Inventor: Hsin-Ying Ho , Hsun-Wei Chan , Lu-Ming Lai , Shih-Chieh Tang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L25/075 ; H01L33/46 ; H01L33/48 ; H01L33/62

Abstract:
In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.
Public/Granted literature
- US20170138566A1 OPTICAL DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-05-18
Information query
IPC分类: