公开(公告)号：US20250048760A1

公开(公告)日：2025-02-06

申请号：US18230579

申请日：2023-08-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Lu-Ming LAI ,  Shih-Chieh TANG

IPC: H01L27/146

Abstract: An electronic device includes an encapsulant, an optical emitter, and an optical sensor. The optical sensor is encapsulated by the encapsulant. The optical emitter is supported by the encapsulant.

公开(公告)号：US20210257246A1

公开(公告)日：2021-08-19

申请号：US16791938

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Ling MA ,  Ying-Chung CHEN ,  Hsin-Ying HO ,  Cheng-Ling HUANG ,  Chang Chin TSAI

IPC: H01L21/683 ,  H01L21/82 ,  H01L31/18 ,  H01L33/00

Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.

公开(公告)号：US20200020827A1

公开(公告)日：2020-01-16

申请号：US16505331

申请日：2019-07-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L33/08 ,  H01L33/10 ,  H01L33/26

Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.

公开(公告)号：US20180017741A1

公开(公告)日：2018-01-18

申请号：US15643458

申请日：2017-07-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: G02B6/42 ,  H01L33/48 ,  H01L25/16 ,  H01L31/0203 ,  B29C43/36 ,  H01S5/022 ,  B29C33/00 ,  B29C35/08

CPC classification number: H01L25/167 ,  G02B6/0018 ,  G02B6/002 ,  G02B6/0025 ,  G02B6/0028 ,  G02B6/0031 ,  G02B6/0036 ,  G02B6/0045 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0065 ,  G02B6/0073 ,  G02B6/0076 ,  G02B6/0091 ,  G02B6/0096 ,  G02B6/4206 ,  G02B6/4212 ,  G02B6/4257 ,  H01L23/142 ,  H01L23/145 ,  H01L23/15 ,  H01L25/165 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/15 ,  H01L31/02327 ,  H01L33/58 ,  H01L2924/12042 ,  H01L2924/16151 ,  H01L2924/16196 ,  H01L2924/16251 ,  H01L2933/0058 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02288 ,  H05K1/03

Abstract: An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.

公开(公告)号：US20170138566A1

公开(公告)日：2017-05-18

申请号：US14939331

申请日：2015-11-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Shih-Chieh TANG

IPC: F21V7/04 ,  F21V7/22 ,  F21V23/00

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.

公开(公告)号：US20210293940A1

公开(公告)日：2021-09-23

申请号：US16825704

申请日：2020-03-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO

IPC: G01S7/497 ,  G01S17/08 ,  G01S7/481

Abstract: An optical assembly includes a light-emitting device, a partition structure and a cover. The partition structure defines a first space for accommodating the light-emitting device. The cover is disposed over the partition structure. The cover has a first surface facing the partition structure and a second surface opposite to the first surface. A light emitted by the light-emitting device forms a first irradiance pattern projected on the second surface of the cover, and the first irradiance pattern includes a first dark zone traversing the first irradiance pattern.

公开(公告)号：US20210225917A1

公开(公告)日：2021-07-22

申请号：US16745139

申请日：2020-01-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO

IPC: H01L27/146 ,  G02B3/00

Abstract: An optical module includes an image sensor and micro lens array. The image sensor has at least one group of pixels. The micro lens array is disposed on the image sensor. The at least one group of pixels is shifted from the micro lens array in a first direction from a top view perspective.

公开(公告)号：US20210210662A1

公开(公告)日：2021-07-08

申请号：US16734046

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen CHIANG ,  Kuang-Hsiung CHEN ,  Lu-Ming LAI ,  Hsun-Wei CHAN ,  Hsin-Ying HO ,  Shih-Chieh TANG

IPC: H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

公开(公告)号：US20180315894A1

公开(公告)日：2018-11-01

申请号：US15909884

申请日：2018-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Tsung-Yu LIN

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/02

Abstract: A semiconductor device package includes a carrier, a semiconductor device disposed on the carrier, and a lid disposed on the semiconductor device. The lid is spaced from the carrier by a first distance. The lid includes a base portion, a first pin extending from the base portion toward the semiconductor device, and a transparent portion. The first pin is spaced from the carrier by a second distance.

公开(公告)号：US20170294564A1

公开(公告)日：2017-10-12

申请号：US15403057

申请日：2017-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Lu-Ming LAI

IPC: H01L33/58 ,  H01L33/56

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/483 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.