Invention Application
- Patent Title: ETCH VARIATION TOLERANT OPTIMIZATION
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Application No.: US15318940Application Date: 2016-12-14
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Publication No.: US20170139320A1Publication Date: 2017-05-18
- Inventor: Xiaofeng LIU
- Applicant: ASML Netherlands B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- International Application: PCT/EP2015/062135 WO 20161214
- Main IPC: G03F1/44
- IPC: G03F1/44 ; G03F1/36 ; G06F17/50 ; G03F1/42

Abstract:
Disclosed herein is a computer-implemented method to improve a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic projection apparatus and for transferring the imaged portion of the design layout to the substrate by an etching process, which includes the following steps: determining a value of at least one evaluation point of the lithographic process for each of a plurality of variations of the etching process; computing a multi-variable cost function of a plurality of design variables that are characteristics of the lithographic process, wherein the multi-variable cost function is a function of deviation from the determined values of the at least one evaluation point; and reconfiguring the characteristics of the lithographic process by adjusting the design variables until a termination condition is satisfied. This method may reduce the need of repeated adjustment to the lithographic process when the etching process varies.
Public/Granted literature
- US10191366B2 Etch variation tolerant optimization Public/Granted day:2019-01-29
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