FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUNDS INCLUDING THE SAME FOR PREPARING SEMICONDUCTOR PACKAGES

Invention Application

US20170141007A1 FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUNDS INCLUDING THE SAME FOR PREPARING SEMICONDUCTOR PACKAGES 审中-公开

Patent Title: FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUNDS INCLUDING THE SAME FOR PREPARING SEMICONDUCTOR PACKAGES
Application No.: US14943519

Application Date: 2015-11-17
Publication No.: US20170141007A1

Publication Date: 2017-05-18
Inventor: Ya-Yu HSIEH , Hong-Ping LIN , Dao-Long CHEN , Ping-Feng YANG , Meng-Kai SHIH
Applicant: Advanced Semiconductor Engineering, Inc.
Assignee: Advanced Semiconductor Engineering, Inc.
Current Assignee: Advanced Semiconductor Engineering, Inc.
Main IPC: H01L23/29
IPC: H01L23/29 ; H01L23/00 ; C08K3/36 ; C09D163/00 ; C08K3/04

Abstract:

The present disclosure relates to a filler composition for a semiconductor package. The filler composition comprises carbon and silica.

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/28	.封装，例如密封层、涂覆物（H01L23/552优先）
H01L23/29	..按材料特点进行区分的