Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE
-
Application No.: US15254259Application Date: 2016-09-01
-
Publication No.: US20170141092A1Publication Date: 2017-05-18
- Inventor: Hyoungjoon Kim , Kwangil PARK , Seok-Hong KWON , Chulsung PARK , Eunsung SEO , Heejin LEE , Kijong PARK
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0158942 20151112
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/00 ; H01L25/065

Abstract:
A semiconductor package includes a logic chip mounted on a substrate, a first memory chip disposed on the logic chip, which includes a first active surface, and a second memory chip disposed on the first memory chip. The second memory chip is disposed on the first memory chip in such a way that the first memory chip and second memory chip are offset from each other. The second memory chip has a second active surface. The first active surface and the second active surface face each other and are electrically connected to each other through a first solder bump.
Public/Granted literature
- US09899361B2 Semiconductor package Public/Granted day:2018-02-20
Information query
IPC分类: