Invention Application
- Patent Title: MEZZANINE FILLER MODULE APPARATUSES AND METHODS FOR COMPUTING DEVICES
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Application No.: US14949075Application Date: 2015-11-23
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Publication No.: US20170147044A1Publication Date: 2017-05-25
- Inventor: David S. Slaton , Jerry Leon Wright , Brian Patrick Hoden
- Applicant: General Electric Company
- Main IPC: G06F1/20
- IPC: G06F1/20

Abstract:
Disclosed herein are systems and methods for the thermal regulation of on-board electronic components using a mezzanine filler module. The mezzanine filler module connects at a mezzanine site of the circuit board to provide an additional thermal conduction path for thermal energy released, at least, from component located under the mezzanine site.
Information query