公开(公告)号：US09750127B2

公开(公告)日：2017-08-29

申请号：US14959553

申请日：2015-12-04

Applicant: General Electric Company

Inventor： Joo Han Kim ,  Michelle Ann Parziale ,  Jerry Leon Wright ,  Hendrik Pieter Jacobus de Bock ,  Brian Patrick Hoden

IPC: H05K1/02 ,  H05K13/04 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20336 ,  H05K7/20636 ,  H05K13/04

Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

公开(公告)号：US20170164459A1

公开(公告)日：2017-06-08

申请号：US14959553

申请日：2015-12-04

Applicant: General Electric Company

Inventor： Joo Han Kim ,  Michelle Ann Parziale ,  Jerry Leon Wright ,  Hendrik Pieter Jacobus de Bock ,  Brian Patrick Hoden

IPC: H05K1/02 ,  H05K13/04 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20336 ,  H05K7/20636 ,  H05K13/04

Abstract: A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

公开(公告)号：US20170147044A1

公开(公告)日：2017-05-25

申请号：US14949075

申请日：2015-11-23

Applicant: General Electric Company

Inventor： David S. Slaton ,  Jerry Leon Wright ,  Brian Patrick Hoden

IPC: G06F1/20

CPC classification number: G06F1/20 ,  H05K1/0209 ,  H05K2201/066

Abstract: Disclosed herein are systems and methods for the thermal regulation of on-board electronic components using a mezzanine filler module. The mezzanine filler module connects at a mezzanine site of the circuit board to provide an additional thermal conduction path for thermal energy released, at least, from component located under the mezzanine site.