- 专利标题: HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS
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申请号: US15430574申请日: 2017-02-13
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公开(公告)号: US20170155598A1公开(公告)日: 2017-06-01
- 发明人: Paul W. Coteus , Fuad E. Doany , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
- 申请人: International Business Machines Corporation
- 主分类号: H04L12/933
- IPC分类号: H04L12/933 ; H05K7/20
摘要:
A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
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