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公开(公告)号：US11497143B2
公开(公告)日：2022-11-08
申请号：US16827645
申请日：2020-03-23
发明人： Paul W. Coteus , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H05K7/20 , H01L23/367 , G06F1/20 , H01L23/473 , H01L23/373 , H01L23/40
摘要： An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.
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公开(公告)号：US11243034B2
公开(公告)日：2022-02-08
申请号：US16926662
申请日：2020-07-11
发明人： Todd E. Takken , Shurong Tian
摘要： A cold plate structure, wherein a thermally active region includes fins metal injection molded in a single piece with a fin base sufficiently thin so that the active region mechanically conforms to the heat generating device that the cold plate cools. The fin base is formed as a common structure with a bottom wall of the cold plate, reducing thermal resistance between the device and the fins and also enhancing mechanical flexibility. Another cold plate structure can include multiple thermally active regions, with flexible outer walls and a reduced thickness between active regions, allowing for position variation between multiple heat generation devices that are cooled by the common cold plate. A common base having multiple physically separate active regions can be metal injection molded in a single step, or bases of multiple active regions can be formed individually and joined later to form a common single cold plate structure.
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公开(公告)号：US10222125B2
公开(公告)日：2019-03-05
申请号：US14818064
申请日：2015-08-04
发明人： Paul W. Coteus , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
摘要： An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.
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公开(公告)号：US09831783B2
公开(公告)日：2017-11-28
申请号：US14983700
申请日：2015-12-30
发明人： Paul W Coteus , Andrew Ferencz , Shawn A Hall , Todd E Takken , Shurong Tian , Xin Zhang
CPC分类号： H02M3/33546 , H02M3/00 , H02M2001/0009
摘要： An apparatus includes a first circuit board including first components including a load, and a second circuit board including second components including switching power devices and an output inductor. Ground and output voltage contacts between the circuit boards are made through soldered or connectorized interfaces. Certain components on the first circuit board and certain components, including the output inductor, on the second circuit board act as a DC-DC voltage converter for the load. An output capacitance for the conversion is on the first circuit board with no board-to-board interface between the output capacitance and the load. The inductance of the board-to-board interface functions as part of the output inductor's inductance and not as a parasitic inductance. Sense components for sensing current through the output inductor are located on the first circuit board. Parasitic inductance of the board-to-board interface has less effect on a sense signal provided to a controller.
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公开(公告)号：US20170160501A1
公开(公告)日：2017-06-08
申请号：US14956484
申请日：2015-12-02
发明人： Mark D. Schultz , Shurong Tian
CPC分类号： G02B6/4269 , G02B6/4242 , G02B6/4244 , G02B6/4245 , G02B6/4267
摘要： An optical coupling system includes a substrate, an electronic die comprising a plurality of coupling holes for passing light, an optical element die attached to a bottom surface of the electronic die, the electronic die attached to the substrate such that the electronic die covers a cavity in the substrate and the optical element die resides within the cavity of the substrate. The system may also include a thermally conductive lid that covers and contacts the electronic die and the substrate and has a coupling aperture that enables light that passes through the coupling holes to pass through the thermally conductive lid. The system may also include an optical cable coupler comprising a coupling section that laterally fits within the coupling aperture and a body section disposed above the coupling section that is laterally larger than the coupling section. A method for providing the above system is also disclosed herein.
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公开(公告)号：US20160290728A1
公开(公告)日：2016-10-06
申请号：US14818117
申请日：2015-08-04
发明人： Paul W. Coteus , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
CPC分类号： F28F3/044 , F28F3/12 , F28F2225/04 , F28F2255/02 , H01L23/473 , H05K7/20254
摘要： An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.
摘要翻译： 用于冷却电子部件的设备具有热能传导材料的平面顶部构件和该材料的平行平面底部构件，平面底部构件包括具有被配置为与电子部件进行热交换接触的区域的表面。 接合的平面顶部和底部构件具有在有源区域之间具有减小的高度（通常为冷板的高度）的侧壁结构，以便提高柔性。 通过非常有利地减小侧壁的高度来减小侧壁的刚度。 在一个实施例中，侧壁的高度较短，仅对应于活动区域之间的区域。 或者，通过将顶部和/或底部片材中的活动区域进行内部填充，侧壁的高度变小。
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公开(公告)号：US11056413B2
公开(公告)日：2021-07-06
申请号：US16417845
申请日：2019-05-21
发明人： Xin Zhang , Todd Takken , Shurong Tian , Yuan Yao
IPC分类号： H01L49/02 , H01L23/64 , H01L23/367
摘要： An inductor includes a conductor having a first end and a second end, wherein the first end, the second end, or both ends are configured to be mounted on a substrate and configured to receive a heat flow; and one or more magnetic cores surrounding a first portion of the conductor, the first portion of the conductor being intermediate the first end and the second end of the conductor. A second portion of the conductor not surrounded by the one or more magnetic cores is configured to transfer the heat flow from the conductor.
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公开(公告)号：US20210193557A1
公开(公告)日：2021-06-24
申请号：US16720599
申请日：2019-12-19
发明人： Yuan Yao , Shurong Tian , Todd Edward Takken
IPC分类号： H01L23/40 , H05K1/18 , H01R13/639
摘要： In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.
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公开(公告)号：US10712102B2
公开(公告)日：2020-07-14
申请号：US15859282
申请日：2017-12-29
发明人： Todd E. Takken , Shurong Tian
摘要： A cold plate structure, wherein a thermally active region includes fins metal injection molded in a single piece with a fin base sufficiently thin so that the active region mechanically conforms to the heat generating device that the cold plate cools. The fin base is formed as a common structure with a bottom wall of the cold plate, reducing thermal resistance between the device and the fins and also enhancing mechanical flexibility. Another cold plate structure can include multiple thermally active regions, with flexible outer walls and a reduced thickness between active regions, allowing for position variation between multiple heat generation devices that are cooled by the common cold plate. A common base having multiple physically separate active regions can be metal injection molded in a single step, or bases of multiple active regions can be formed individually and joined later to form a common single cold plate structure.
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公开(公告)号：US20200221610A1
公开(公告)日：2020-07-09
申请号：US16827645
申请日：2020-03-23
发明人： Paul W. Coteus , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H05K7/20 , H01L23/367 , G06F1/20 , H01L23/473
摘要： An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.
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