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公开(公告)号：US11817250B2
公开(公告)日：2023-11-14
申请号：US16405071
申请日：2019-05-07
发明人： Todd E. Takken , Xin Zhang
CPC分类号： H01F27/2804 , H01F41/041 , H01F2027/2819
摘要： A broadside coupled coplanar inductor device includes first and second coplanar inductors in which the conductors of the first and second coplanar inductors are broadside coupled. The conductors are located one above the other at a first distance and the return paths are located to the side of the respective first and second conductor signal paths at a second distance. One or both of the dimensions of the first and second first distances is defined so as to maximize a mutual inductance between the conductors. First and second driver circuit apply voltages across each conductor. The input pulse width modulation signals applied to the first and second driver circuits are 180 degrees out of phase.
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公开(公告)号：US20200295045A1
公开(公告)日：2020-09-17
申请号：US16355008
申请日：2019-03-15
发明人： Ko-Tao Lee , Xin Zhang , Todd E. Takken
IPC分类号： H01L27/12 , H01L29/78 , H01L29/778 , H01L29/04 , H01L21/84
摘要： One silicon MOSFET transistor, which is used as the VThreshold control, and a GaN power HEMT are integrated on a single die to enable a fully integrated depletion-mode power device. GaN area is created on a silicon substrate and GaN FETs are built in the GaN area. Outside of the GaN area, silicon transistors such as switch MOSFETs are built. Front end of line or back end of line metal connections are then made to create interconnections among the GaN FET and the silicon transistor. The short physical proximity of the silicon transistor and GaN HEMT significantly reduces the parasitic resistance and inductance between them. Thus, high speed signals are able to travel from the silicon transistor to the GaN HEMT with a higher frequency and lower distortion, without creating overshoot voltage when there is large parasitic inductance. Therefore, the cascode device can operate at a higher switching frequency.
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公开(公告)号：US10712102B2
公开(公告)日：2020-07-14
申请号：US15859282
申请日：2017-12-29
发明人： Todd E. Takken , Shurong Tian
摘要： A cold plate structure, wherein a thermally active region includes fins metal injection molded in a single piece with a fin base sufficiently thin so that the active region mechanically conforms to the heat generating device that the cold plate cools. The fin base is formed as a common structure with a bottom wall of the cold plate, reducing thermal resistance between the device and the fins and also enhancing mechanical flexibility. Another cold plate structure can include multiple thermally active regions, with flexible outer walls and a reduced thickness between active regions, allowing for position variation between multiple heat generation devices that are cooled by the common cold plate. A common base having multiple physically separate active regions can be metal injection molded in a single step, or bases of multiple active regions can be formed individually and joined later to form a common single cold plate structure.
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公开(公告)号：US20200221610A1
公开(公告)日：2020-07-09
申请号：US16827645
申请日：2020-03-23
发明人： Paul W. Coteus , Mark D. Schultz , Todd E. Takken , Shurong Tian
IPC分类号： H05K7/20 , H01L23/367 , G06F1/20 , H01L23/473
摘要： An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.
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公开(公告)号：US10568236B2
公开(公告)日：2020-02-18
申请号：US15854986
申请日：2017-12-27
发明人： Shurong Tian , Todd E. Takken
摘要： A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.
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公开(公告)号：US20190357354A1
公开(公告)日：2019-11-21
申请号：US16528908
申请日：2019-08-01
发明人： Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz
摘要： A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.
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公开(公告)号：US20190204023A1
公开(公告)日：2019-07-04
申请号：US15859282
申请日：2017-12-29
发明人： Todd E. Takken , Shurong Tian
摘要： A cold plate structure, wherein a thermally active region includes fins metal injection molded in a single piece with a fin base sufficiently thin so that the active region mechanically conforms to the heat generating device that the cold plate cools. The fin base is formed as a common structure with a bottom wall of the cold plate, reducing thermal resistance between the device and the fins and also enhancing mechanical flexibility. Another cold plate structure can include multiple thermally active regions, with flexible outer walls and a reduced thickness between active regions, allowing for position variation between multiple heat generation devices that are cooled by the common cold plate. A common base having multiple physically separate active regions can be metal injection molded in a single step, or bases of multiple active regions can be formed individually and joined later to form a common single cold plate structure.
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公开(公告)号：US10321564B2
公开(公告)日：2019-06-11
申请号：US15808786
申请日：2017-11-09
发明人： Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz
摘要： A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.
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公开(公告)号：US20190141830A1
公开(公告)日：2019-05-09
申请号：US15808797
申请日：2017-11-09
发明人： Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz
CPC分类号： H05K1/0298 , H05K1/117 , H05K3/366 , H05K3/403 , H05K13/04 , H05K2201/09145 , H05K2201/0919
摘要： A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.
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公开(公告)号：US20190141829A1
公开(公告)日：2019-05-09
申请号：US15808786
申请日：2017-11-09
发明人： Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz
摘要： A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.
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