Invention Application
- Patent Title: Capacitor Formed On Heavily Doped Substrate
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Application No.: US15347213Application Date: 2016-11-09
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Publication No.: US20170162648A1Publication Date: 2017-06-08
- Inventor: Greg Dix , Randy Yach , Francesco Mazzilli
- Applicant: Microchip Technology Incorporated
- Applicant Address: US AZ Chandler
- Assignee: Microchip Technology Incorporated
- Current Assignee: Microchip Technology Incorporated
- Current Assignee Address: US AZ Chandler
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L21/52 ; H01L21/311 ; H01L23/00 ; H01L23/31

Abstract:
The teachings of the present disclosure may be applied to the manufacture and design of capacitors. In some embodiments of these teachings, a capacitor may be formed on a heavily doped substrate. For example, a method for manufacturing a capacitor may include: depositing an oxide layer on a first side of a heavily doped substrate; depositing a first metal layer on the oxide layer; and depositing a second metal layer on a second side of the heavily doped substrate.
Public/Granted literature
- US10217810B2 Capacitor formed on heavily doped substrate Public/Granted day:2019-02-26
Information query
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