A mounting substrate includes a substrate, a connection electrode, which is formed on a front surface of the substrate and on which an electronic component is mounted via a conductive bonding material, a resist film, formed on the front surface of the substrate so as to cover a peripheral edge portion of the connection electrode, and a receiving portion, formed in the resist film so as to expose a portion of the peripheral edge portion of the connection electrode and arranged to receive an excess portion of the conductive bonding material.