公开(公告)号：US20170164472A1

公开(公告)日：2017-06-08

申请号：US15360573

申请日：2016-11-23

Applicant: ROHM CO., LTD.

Inventor： Katsuya MATSUURA ,  Hiroshi TAMAGAWA

IPC: H05K1/11 ,  H05K3/28 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/287 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09036 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A mounting substrate includes a substrate, a connection electrode, which is formed on a front surface of the substrate and on which an electronic component is mounted via a conductive bonding material, a resist film, formed on the front surface of the substrate so as to cover a peripheral edge portion of the connection electrode, and a receiving portion, formed in the resist film so as to expose a portion of the peripheral edge portion of the connection electrode and arranged to receive an excess portion of the conductive bonding material.

公开(公告)号：US20150305159A1

公开(公告)日：2015-10-22

申请号：US14440016

申请日：2013-10-25

Applicant: ROHM CO., LTD.

Inventor： Hiroki YAMAMOTO ,  Keishi WATANABE ,  Hiroshi TAMAGAWA

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H01G4/40 ,  H01L22/14 ,  H01L22/20 ,  H01L23/5223 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0629 ,  H01L27/0676 ,  H01L27/101 ,  H01L27/2409 ,  H01L28/40 ,  H01L29/66189 ,  H01L29/94 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/162 ,  H05K1/18 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10045 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

Abstract translation: 根据本发明的片状电容器包括衬底，形成在衬底上的一对外部电极，连接在一对外部电极之间的电容器元件和连接在该对外部电极之间并与电容器并联的双向二极管 元件。 此外，根据本发明的电路组件包括根据本发明的片状电容器和具有焊盘焊接到外部电极的焊盘的安装基板，在与衬底的前表面相对的安装表面上。

公开(公告)号：US20190148480A1

公开(公告)日：2019-05-16

申请号：US16250453

申请日：2019-01-17

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Yasuhiro FUWA ,  Hiroyuki OKADA ,  Eiji NUKAGA ,  Katsuya MATSUURA

IPC: H01L49/02 ,  H01L21/3065 ,  H01L21/308 ,  H01C13/02 ,  H01C1/14 ,  H01L27/06 ,  H01L27/08

Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

公开(公告)号：US20180042118A1

公开(公告)日：2018-02-08

申请号：US15670627

申请日：2017-08-07

Applicant: ROHM CO., LTD.

Inventor： Yasuhiro KONDO ,  Katsuya MATSUURA ,  Hiroshi TAMAGAWA

IPC: H05K3/04 ,  H01L23/66 ,  H05K13/02 ,  H05K3/00 ,  B23K1/005

CPC classification number: H05K3/045 ,  B23K1/0056 ,  H01L21/6836 ,  H01L21/71 ,  H01L21/78 ,  H01L22/12 ,  H01L23/3185 ,  H01L23/3192 ,  H01L23/564 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L2221/68327 ,  H01L2224/03462 ,  H01L2224/0348 ,  H01L2224/0401 ,  H01L2224/05164 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05644 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/94 ,  H01L2924/10158 ,  H05K1/0274 ,  H05K3/002 ,  H05K3/0044 ,  H05K13/024 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2924/014

Abstract: A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.

公开(公告)号：US20170365655A1

公开(公告)日：2017-12-21

申请号：US15647592

申请日：2017-07-12

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Yasuhiro FUWA ,  Hiroyuki OKADA ,  Eiji NUKAGA ,  Katsuya MATSUURA

IPC: H01L49/02 ,  H01C13/02 ,  H01L21/3065 ,  H01L27/08 ,  H01L27/06 ,  H01L21/308 ,  H01C1/14 ,  H05K3/34 ,  H01C17/00 ,  H01C17/242

CPC classification number: H01L28/20 ,  H01C1/14 ,  H01C13/02 ,  H01C17/006 ,  H01C17/242 ,  H01L21/3065 ,  H01L21/3083 ,  H01L27/0676 ,  H01L27/0802 ,  H05K3/3431 ,  H05K2201/10674

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

公开(公告)号：US20150216044A1

公开(公告)日：2015-07-30

申请号：US14581460

申请日：2014-12-23

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Hiroki YAMAMOTO

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/09 ,  H05K5/00 ,  H05K1/11

CPC classification number: H01L27/016 ,  H01C1/14 ,  H01C1/142 ,  H01C7/003 ,  H01C7/006 ,  H01C17/006 ,  H01G4/012 ,  H01G4/30 ,  H01G4/33 ,  H01L27/0802 ,  H01L27/0805 ,  H01L28/20 ,  H01L28/60 ,  H05K1/167 ,  Y10T29/49158

Abstract: The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.

Abstract translation: 本发明的芯片部分包括基板，基板上的电极，并且具有朝向其厚度方向形成有多个凹部的前表面，以及元件区域，电路元件电连接到 电极。

公开(公告)号：US20190200458A1

公开(公告)日：2019-06-27

申请号：US16286503

申请日：2019-02-26

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Koichi NIINO ,  Eiji NUKAGA ,  Keishi WATANABE

IPC: H05K1/18 ,  H05K5/02 ,  H01C1/012 ,  H01C1/14 ,  H01G2/06 ,  H01G4/228 ,  H05K1/11

Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.

公开(公告)号：US20170236765A1

公开(公告)日：2017-08-17

申请号：US15383336

申请日：2016-12-19

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO

IPC: H01L23/31 ,  H01L21/78 ,  H01L21/3065 ,  H01L21/56 ,  H01L29/34 ,  H01L23/00

CPC classification number: H01L23/3178 ,  H01L21/30655 ,  H01L21/56 ,  H01L21/78 ,  H01L23/3185 ,  H01L23/3192 ,  H01L23/562 ,  H01L24/05 ,  H01L24/13 ,  H01L29/34 ,  H01L2224/02206 ,  H01L2224/02215 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/13026 ,  H01L2224/13083 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/07025

Abstract: A chip part includes a substrate that has an upper surface, a lower surface positioned on an opposite side of the upper surface, and a sidewall by which the upper surface and the lower surface are connected together and that has a plurality of concavo-convex portions formed on the sidewall from a side of the upper surface toward a side of the lower surface, a functional element formed at the side of the upper surface of the substrate, a first external electrode and a second external electrode that are arranged at the upper surface of the substrate so as to be electrically connected to the functional element, and a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film.

公开(公告)号：US20170221611A1

公开(公告)日：2017-08-03

申请号：US15490333

申请日：2017-04-18

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Hiroki YAMAMOTO ,  Katsuya MATSUURA ,  Yasuhiro KONDO

IPC: H01C1/14 ,  H01C10/16 ,  H01C17/00 ,  H01G5/40 ,  H01L33/62 ,  H05K1/18 ,  H05K3/34 ,  H01F29/08 ,  H01F41/04 ,  H01L27/15 ,  H01G5/011 ,  H01G5/38

CPC classification number: H01C1/14 ,  H01C10/16 ,  H01C10/50 ,  H01C17/006 ,  H01C17/23 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/40 ,  H01F29/00 ,  H01F29/08 ,  H01F41/041 ,  H01G2/16 ,  H01G4/33 ,  H01G4/38 ,  H01G4/40 ,  H01G5/011 ,  H01G5/38 ,  H01G5/40 ,  H01L24/32 ,  H01L25/105 ,  H01L25/13 ,  H01L27/0802 ,  H01L27/15 ,  H01L33/62 ,  H01L2221/68304 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2933/0066 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3478 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10212 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00

Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

公开(公告)号：US20170186517A1

公开(公告)日：2017-06-29

申请号：US15454864

申请日：2017-03-09

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO

IPC: H01C1/16 ,  H01C10/50 ,  H01C17/00 ,  H01C1/14 ,  H01C1/012

CPC classification number: H01C1/16 ,  H01C1/012 ,  H01C1/14 ,  H01C10/50 ,  H01C17/006 ,  H01C17/23 ,  H01L27/016 ,  H01L27/0207 ,  H01L28/24 ,  H05K3/3442 ,  H05K2201/10212 ,  Y02P70/613

Abstract: A chip resistor has a substrate, a first connection electrode and a second connection electrode that are formed on the substrate, and a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and the other one of which is connected to the second connection electrode. The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line that is provided along inner wall surfaces of trenches. The resistive element film line extending along the inner wall surfaces of the trenches is long and has a high resistivity as a unit resistive element.