发明申请
- 专利标题: ARRAY SUBSTRATE, ITS DRIVING METHOD AND MANUFACTURING METHOD, AND DISPLAY DEVICE
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申请号: US15233408申请日: 2016-08-10
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公开(公告)号: US20170205953A1公开(公告)日: 2017-07-20
- 发明人: Chaochao SUN , Huafeng LIU , Shengwei ZHAO , Kai ZHANG , Lei YANG , Lulu YE , Jingping LV , Chao WANG , Chongliang HU , Meng YANG , Duolong DING , Bule SHUN , Lin XIE , Yao LI , Shimin SUN
- 申请人: BOE TECHNOLOGY GROUP CO., LTD. , ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- 申请人地址: CN Beijing CN Ordos
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.,ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.,ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- 当前专利权人地址: CN Beijing CN Ordos
- 优先权: CN201610025575.8 20160114
- 主分类号: G06F3/041
- IPC分类号: G06F3/041 ; G02F1/1362 ; G09G3/36 ; H01L27/12 ; G06F3/044
摘要:
The present disclosure provides an array substrate, its driving method and manufacturing method, and a display device. The array substrate includes a transistor layer arranged on a base, and a first transparent conductive layer, a first insulation layer, a second transparent conductive layer, a second insulation layer and a third transparent conductive layer sequentially arranged on the transistor layer. The first transparent conductive layer covers the transistor layer at a display area, the second transparent conductive layer includes a pattern of touch electrodes, and the third transparent conductive layer includes a pattern of pixel electrodes. Within any pixel area of the display area, the pixel electrode is connected to a pixel electrode connection end of the transistor layer through a via-hole in the first insulation layer and the second insulation layer, and the first transparent conductive layer is provided with an opening at a position corresponding to the via-hole.
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