- 专利标题: 3D SEMICONDUCTOR DEVICE AND SYSTEM
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申请号: US15488514申请日: 2017-04-16
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公开(公告)号: US20170221761A1公开(公告)日: 2017-08-03
- 发明人: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist , Zeev Wurman
- 申请人: Monolithic 3D Inc.
- 申请人地址: US CA San Jose
- 专利权人: Monolithic 3D Inc.
- 当前专利权人: Monolithic 3D Inc.
- 当前专利权人地址: US CA San Jose
- 优先权: USPCT/US2011/042071 20110628
- 主分类号: H01L21/77
- IPC分类号: H01L21/77 ; H01L27/10 ; H01L27/02 ; H01L23/00 ; H01L23/31 ; H01L29/66 ; H01L23/40
摘要:
A 3D integrated circuit device, including: a first transistor; a second transistor; and a third transistor, where the third transistor is overlaying the second transistor and the third transistor is controlled by a third control line, where the second transistor is overlaying the first transistor and the second transistor is controlled by a second control line, where the first transistor is part of a control circuit controlling the second control line and the third control line, and where the second transistor and the third transistor are self-aligned.
公开/授权文献
- US09953870B2 3D semiconductor device and system 公开/授权日:2018-04-24
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