Invention Application
- Patent Title: METAL-CONTAINING THERMAL AND DIFFUSION BARRIER LAYER FOR FOIL-BASED METALLIZATION OF SOLAR CELLS
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Application No.: US15492382Application Date: 2017-04-20
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Publication No.: US20170222073A1Publication Date: 2017-08-03
- Inventor: Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsene Olivier Ngamo Toko
- Applicant: Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsene Olivier Ngamo Toko
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01L31/028 ; H01L31/0368 ; H01L31/077 ; H01L31/056 ; H01L31/0236

Abstract:
Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.
Public/Granted literature
- US10032942B2 Solar cell having Ti- or Ta-containing thermal and diffusion barrier layer for foil-based metallization Public/Granted day:2018-07-24
Information query
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