-
1.
公开(公告)号:US20170222073A1
公开(公告)日:2017-08-03
申请号:US15492382
申请日:2017-04-20
申请人: Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsene Olivier Ngamo Toko
发明人: Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsene Olivier Ngamo Toko
IPC分类号: H01L31/0224 , H01L31/028 , H01L31/0368 , H01L31/077 , H01L31/056 , H01L31/0236
CPC分类号: H01L31/022458 , H01L31/022441 , H01L31/02366 , H01L31/028 , H01L31/035281 , H01L31/03682 , H01L31/05 , H01L31/0516 , H01L31/0547 , H01L31/056 , H01L31/0745 , H01L31/077 , H01L31/1804 , H01L31/182 , Y02E10/50
摘要: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.
-
公开(公告)号:US09634178B1
公开(公告)日:2017-04-25
申请号:US14971335
申请日:2015-12-16
申请人: Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsène Olivier Ngamo Toko
发明人: Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsène Olivier Ngamo Toko
IPC分类号: H01L31/18 , H01L31/05 , H01L31/054 , H01L31/0368 , H01L31/0224
CPC分类号: H01L31/022458 , H01L31/022441 , H01L31/02366 , H01L31/028 , H01L31/035281 , H01L31/03682 , H01L31/05 , H01L31/0516 , H01L31/0547 , H01L31/056 , H01L31/0745 , H01L31/077 , H01L31/1804 , H01L31/182 , Y02E10/50
摘要: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.
-
公开(公告)号:US09231129B2
公开(公告)日:2016-01-05
申请号:US14229716
申请日:2014-03-28
申请人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
发明人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号: H01L21/00 , H01L31/0224 , H01L31/0687 , H01L31/02
CPC分类号: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
摘要翻译: 描述了用于太阳能电池和所得太阳能电池的箔基金属化的方法。 在一个示例中,太阳能电池包括基板。 多个交替的N型和P型半导体区域设置在衬底中或上方。 导电接触结构设置在多个交替的N型和P型半导体区域的上方。 导电接触结构包括多个金属种子材料区域,其提供设置在每个交替的N型和P型半导体区域上的金属种子材料区域。 金属箔设置在多个金属种子材料区域上,金属箔具有阳极化部分,隔离与交替的N型和P型半导体区对应的金属箔的金属区域。
-
公开(公告)号:US09627566B2
公开(公告)日:2017-04-18
申请号:US14954030
申请日:2015-11-30
申请人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
发明人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号: H01L31/0224 , H01L31/028 , H01L31/0475 , H01L31/05 , H01L31/0236 , H01L31/0745
CPC分类号: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
-
公开(公告)号:US20160079450A1
公开(公告)日:2016-03-17
申请号:US14954030
申请日:2015-11-30
申请人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
发明人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号: H01L31/0224 , H01L31/0475 , H01L31/028 , H01L31/05
CPC分类号: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
-
公开(公告)号:US20170222068A1
公开(公告)日:2017-08-03
申请号:US15485840
申请日:2017-04-12
申请人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
发明人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号: H01L31/0224 , H01L31/0475 , H01L31/028 , H01L31/05
CPC分类号: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
-
公开(公告)号:US20150280021A1
公开(公告)日:2015-10-01
申请号:US14229716
申请日:2014-03-28
申请人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
发明人: Gabriel Harley , Taeseok Kim , Richard Hamilton Sewell , Michael Morse , David D. Smith , Matthieu Moors , Jens-Dirk Moschner
IPC分类号: H01L31/0224 , H01L31/02 , H01L31/0687
CPC分类号: H01L31/02245 , H01L31/022441 , H01L31/02363 , H01L31/028 , H01L31/0475 , H01L31/0512 , H01L31/0516 , H01L31/0682 , H01L31/0745 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
摘要翻译: 描述了用于太阳能电池和所得太阳能电池的箔基金属化的方法。 在一个示例中,太阳能电池包括基板。 多个交替的N型和P型半导体区域设置在衬底中或上方。 导电接触结构设置在多个交替的N型和P型半导体区域的上方。 导电接触结构包括多个金属种子材料区域,其提供设置在每个交替的N型和P型半导体区域上的金属种子材料区域。 金属箔设置在多个金属种子材料区域上,金属箔具有阳极化部分,隔离与交替的N型和P型半导体区对应的金属箔的金属区域。
-
-
-
-
-
-