发明申请
- 专利标题： SEMICONDUCTOR DEVICE
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申请号： US15496782申请日： 2017-04-25
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公开(公告)号： US20170229382A1公开(公告)日： 2017-08-10
- 发明人: Shoji YASUNAGA , Akihiro KOGA
- 申请人： ROHM CO., LTD.
- 优先权： JP2013-058545 20130321; JP2013-058546 20130321; JP2013-058547 20130321; JP2013-058548 20130321; JP2013-058549 20130321; JP2014-011051 20140124
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/31 ; H01L23/373 ; H01L23/00
摘要：
A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.
公开/授权文献
- US10083900B2 Semiconductor device 公开/授权日：2018-09-25
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