公开(公告)号：US20170229382A1

公开(公告)日：2017-08-10

申请号：US15496782

申请日：2017-04-25

Applicant: ROHM CO., LTD.

Inventor： Shoji YASUNAGA ,  Akihiro KOGA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/3731 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/52 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49505 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85951 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.

公开(公告)号：US20140225243A1

公开(公告)日：2014-08-14

申请号：US14257217

申请日：2014-04-21

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49548 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/42 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

Abstract translation: 公开了一种半导体器件。 半导体器件具有半导体芯片，具有半导体芯片接合的上表面的岛，设置在岛上的引线，在半导体芯片的表面和引线的上表面之间延伸的接合线，以及 树脂封装密封半导体芯片，岛，引线和接合线，而岛的下表面和引线的下表面暴露在树脂封装的后表面上，并且引线设置有 从下表面侧凹入并在其侧面开口的凹部。

公开(公告)号：US20230298990A1

公开(公告)日：2023-09-21

申请号：US18023272

申请日：2021-10-06

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA

IPC: H01L23/498 ,  H01L23/495 ,  H01L23/367 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L23/49861 ,  H01L23/49575 ,  H01L23/49548 ,  H01L23/49513 ,  H01L23/367 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48247 ,  H01L2224/48139 ,  H01L2224/49171 ,  H01L2924/18165 ,  H01L2924/13091 ,  H01L2924/13055 ,  H01L2924/12 ,  H01L24/49

Abstract: A semiconductor device includes a lead, a semiconductor element, and a sealing resin. The lead includes an island portion having an obverse surface and a reverse surface facing opposite sides in a thickness direction. The semiconductor element is mounted on the obverse surface of the island portion. The sealing resin covers the semiconductor element and the island portion. The sealing resin has a first portion and a second portion that overlaps with the island portion as viewed in the thickness direction. The sealing resin is configured such that the infrared transmittance of the second portion is higher than that of the first portion.

公开(公告)号：US20180138108A1

公开(公告)日：2018-05-17

申请号：US15870847

申请日：2018-01-12

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Toichi NAGAHARA

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor part includes a resin package and an exposed portion exposed from a bottom surface of the resin package. The exposed portion has a first diagonal line perpendicular to both first and third sides of the package as viewed from the bottom surface. The exposed portion also has a second diagonal line perpendicular to both the second fourth side in the bottom view. A first lead terminal portion opposes the exposed portion and has a first shape in the bottom view. A second lead terminal portion, also opposing the exposed portion, has a second shape in the bottom view. A third lead terminal portion opposing the exposed portion, also has the second shape in the bottom view. A fourth lead terminal portion, similarly opposed to the exposed portion, likewise has the second shape in the bottom view.

公开(公告)号：US20170162480A1

公开(公告)日：2017-06-08

申请号：US15442350

申请日：2017-02-24

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Toichi NAGAHARA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/49541 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor device includes a resin package, a semiconductor chip sealed in the package and having first and second pads on a front surface. An island of the device has a projecting terminal sealed in the package, to one surface of which a back surface of the chip is bonded, and the other surface of which is partially exposed from a bottom surface of the package as a first terminal. A lead separate from the island is sealed in the package and has one surface electrically connected with the second pad, and another surface exposed from the package bottom surface as a second terminal capable of electrical connection between the second pad and outside. A mass center of the chip is away from a center of the package, the projecting terminal is as large as the lead, and solder under the device spreads to the island projecting terminal.

公开(公告)号：US20150340350A1

公开(公告)日：2015-11-26

申请号：US14717757

申请日：2015-05-20

Applicant: ROHM CO., Ltd.

Inventor： Akihiro KOGA

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/07 ,  H01L23/373 ,  H01L23/00 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01L23/3735 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/48 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/07 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85447 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/05432 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1426 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/20753

Abstract: A semiconductor device includes a semiconductor element, a substrate, a lead, and a sealing resin member. The semiconductor element has a first electrode and a second electrode located on opposite sides in the thickness direction. The substrate has an insulating base and a conductive plate. The base has first and second surfaces located on opposite sides in the thickness direction. The conductive plate is bonded to the first surface of the base and electrically connected to the second electrode of the semiconductor element. The lead has an island electrically connected to the first electrode. The sealing resin member covers at least the semiconductor element.

Abstract translation: 半导体器件包括半导体元件，衬底，引线和密封树脂构件。 半导体元件具有位于厚度方向的相对侧上的第一电极和第二电极。 基板具有绝缘基底和导电板。 底座具有位于厚度方向的相对侧上的第一和第二表面。 导电板结合到基底的第一表面并与半导体元件的第二电极电连接。 引线具有电连接到第一电极的岛。 密封树脂构件至少覆盖半导体元件。

公开(公告)号：US20150179554A1

公开(公告)日：2015-06-25

申请号：US14637565

申请日：2015-03-04

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49548 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/42 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

Abstract translation: 公开了一种半导体器件。 半导体器件具有半导体芯片，具有半导体芯片接合的上表面的岛，设置在岛上的引线，在半导体芯片的表面和引线的上表面之间延伸的接合线，以及 树脂封装密封半导体芯片，岛，引线和接合线，而岛的下表面和引线的下表面暴露在树脂封装的后表面上，并且引线设置有 从下表面侧凹入并在其侧面开口的凹部。

公开(公告)号：US20170287817A1

公开(公告)日：2017-10-05

申请号：US15629243

申请日：2017-06-21

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

CPC classification number: H01L23/49548 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/42 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

公开(公告)号：US20160365299A1

公开(公告)日：2016-12-15

申请号：US15250492

申请日：2016-08-29

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA

IPC: H01L23/373 ,  H01L23/00 ,  H01L25/18 ,  H01L23/31

CPC classification number: H01L23/3735 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/48 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/07 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85447 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/05432 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1426 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/20753

Abstract: A semiconductor device includes a semiconductor element, a substrate, a lead, and a sealing resin member. The semiconductor element has a first electrode and a second electrode located on opposite sides in the thickness direction. The substrate has an insulating base and a conductive plate. The base has first and second surfaces located on opposite sides in the thickness direction. The conductive plate is bonded to the first surface of the base and electrically connected to the second electrode of the semiconductor element. The lead has an island electrically connected to the first electrode. The sealing resin member covers at least the semiconductor element.

公开(公告)号：US20160307827A1

公开(公告)日：2016-10-20

申请号：US15192824

申请日：2016-06-24

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Toichi NAGAHARA

IPC: H01L23/495 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor device includes a resin package, a semiconductor chip sealed in the package and having first and second pads on a front surface. An island of the device has a projecting terminal sealed in the package, to one surface of which a back surface of the chip is bonded, and the other surface of which is partially exposed from a bottom surface of the package as a first terminal. A lead separate from the island is sealed in the package and has one surface electrically connected with the second pad, and another surface exposed from the package bottom surface as a second terminal capable of electrical connection between the second pad and outside. A mass center of the chip is away from a center of the package, the projecting terminal is as large as the lead, and solder under the device spreads to the island projecting terminal.

Abstract translation: 半导体器件包括树脂封装，密封在封装中并在前表面上具有第一和第二焊盘的半导体芯片。 所述装置的岛具有密封在所述封装中的突出端子，在所述封装的一个表面上，所述芯片的背面被接合，并且其另一表面作为第一端子从所述封装的底表面部分露出。 与岛分离的引线密封在封装中，并且具有与第二焊盘电连接的一个表面，以及从封装底表面露出的另一个表面作为能够在第二焊盘和外部之间电连接的第二端子。 芯片的质量中心远离封装的中心，突出端子与引线一样大，并且器件下的焊料扩散到岛状突出端子。