公开(公告)号：US20170229382A1

公开(公告)日：2017-08-10

申请号：US15496782

申请日：2017-04-25

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA ,  Akihiro KOGA

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00

CPC分类号： H01L23/3731 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/52 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49505 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85951 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.

公开(公告)号：US20160181186A1

公开(公告)日：2016-06-23

申请号：US15058863

申请日：2016-03-02

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/73 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/2733 ,  H01L2224/29034 ,  H01L2224/32057 ,  H01L2224/32059 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48011 ,  H01L2224/4805 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor device includes a semiconductor chip, a lead arranged on a side portion of the semiconductor chip, and a wire, whose one end and another end are bonded to the semiconductor chip and the lead respectively, having a ball portion and a stitch portion wedged in side elevational view on the semiconductor chip and the lead respectively. An angle of approach of the wire to the lead is not less than 50°, and the length of the stitch portion is not less than 33 μm.

摘要翻译： 半导体器件包括半导体芯片，布置在半导体芯片的侧部上的引线和一端和另一端分别与半导体芯片和引线接合的导线，具有球部和楔形部分楔入 在半导体芯片和铅的侧视图中。 导线与引线的接近角度不小于50°，线圈部分的长度不小于33μm。

公开(公告)号：US20160300776A1

公开(公告)日：2016-10-13

申请号：US15184560

申请日：2016-06-16

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA ,  Akihiro KOGA

IPC分类号： H01L23/373 ,  H01L23/367 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L23/3731 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/52 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49505 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85951 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.

摘要翻译： 半导体器件包括两个或更多个半导体元件，其上安装有半导体元件的岛部的引线，用于从岛部散发热的散热构件，将岛部和散热构件接合的接合层，以及 覆盖半导体元件的密封树脂，岛部和散热构件的一部分。 接合层分别包括为岛部设置的相互间隔开的各个区域。

公开(公告)号：US20140284784A1

公开(公告)日：2014-09-25

申请号：US14220383

申请日：2014-03-20

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA ,  Akihiro KOGA

IPC分类号： H01L23/34 ,  H01L23/52

CPC分类号： H01L23/3731 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/52 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49505 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85951 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.

摘要翻译： 半导体器件包括两个或更多个半导体元件，其上安装有半导体元件的岛部的引线，用于从岛部散发热的散热构件，将岛部和散热构件接合的接合层，以及 覆盖半导体元件的密封树脂，岛部和散热构件的一部分。 接合层分别包括为岛部设置的相互间隔开的各个区域。

公开(公告)号：US20180068972A1

公开(公告)日：2018-03-08

申请号：US15811542

申请日：2017-11-13

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L24/73 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/2733 ,  H01L2224/29034 ,  H01L2224/32057 ,  H01L2224/32059 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48011 ,  H01L2224/4805 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor device includes a semiconductor chip, a lead arranged on a side portion of the semiconductor chip, and a wire, whose one end and another end are bonded to the semiconductor chip and the lead respectively, having a ball portion and a stitch portion wedged in side elevational view on the semiconductor chip and the lead respectively. An angle of approach of the wire to the lead is not less than 50°, and the length of the stitch portion is not less than 33 μm.

公开(公告)号：US20170084569A1

公开(公告)日：2017-03-23

申请号：US15370436

申请日：2016-12-06

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L24/73 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/2733 ,  H01L2224/29034 ,  H01L2224/32057 ,  H01L2224/32059 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48011 ,  H01L2224/4805 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor device includes a semiconductor chip, a lead arranged on a side portion of the semiconductor chip, and a wire, whose one end and another end are bonded to the semiconductor chip and the lead respectively, having a ball portion and a stitch portion wedged in side elevational view on the semiconductor chip and the lead respectively. An angle of approach of the wire to the lead is not less than 50°, and the length of the stitch portion is not less than 33 μm.

公开(公告)号：US20150255369A1

公开(公告)日：2015-09-10

申请号：US14722745

申请日：2015-05-27

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA ,  Mamoru YAMAGAMI

IPC分类号： H01L23/373 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/0612 ,  H01L2224/06505 ,  H01L2224/14104 ,  H01L2224/145 ,  H01L2224/1451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4912 ,  H01L2224/495 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： [Object]A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution]A semiconductor device includes: a die pad 11 which has a die pad main surface 111 and a die pad rear surface 112; a semiconductor chip 41 mounted on the die pad main surface 111; a sealing resin portion 7 formed with a recess 75 for exposure of the die pad rear surface 11 and covering the die pad 11 and the semiconductor chip 41; and a heat releasing layer 6 disposed in the recess 75. The recess 75 has a recess groove 753 outside the die pad 11 in a direction in which the die pad rear surface 112 extends, and the recess groove 753 is closer to the die pad main surface 111 than to the die pad rear surface 112. The heat releasing layer 6 has a junction layer which is in contact with the die pad rear surface 112 and having part thereof filling the recess groove 753.

摘要翻译： 半导体器件被配置为更有效地从半导体芯片释放热量。 解决方案的半导体器件包括：具有管芯焊盘主表面111和管芯焊盘后表面112的管芯焊盘11; 安装在芯片主表面111上的半导体芯片41; 密封树脂部分7，形成有用于暴露芯片垫背面11并覆盖芯片焊盘11和半导体芯片41的凹部75; 以及设置在凹部75中的散热层6.凹部75在芯片焊盘后表面112延伸的方向上具有凹部凹槽753，并且凹槽753更靠近模具垫主体 表面111相对于管芯焊盘后表面112.散热层6具有与管芯焊盘后表面112接触并且其部分填充凹槽753的接合层。

公开(公告)号：US20190378787A1

公开(公告)日：2019-12-12

申请号：US16549535

申请日：2019-08-23

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA ,  Akihiro KOGA

IPC分类号： H01L23/495 ,  H01L23/52 ,  H01L23/00 ,  H01L23/433 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373

摘要： A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.

公开(公告)号：US20180366397A1

公开(公告)日：2018-12-20

申请号：US16114900

申请日：2018-08-28

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA ,  Akihiro KOGA

IPC分类号： H01L23/495 ,  H01L23/373 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49568 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/52 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49505 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85951 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.

公开(公告)号：US20180130725A1

公开(公告)日：2018-05-10

申请号：US15868798

申请日：2018-01-11

申请人： ROHM CO., LTD.

发明人： Shoji YASUNAGA ,  Mamoru YAMAGAMI

IPC分类号： H01L23/495 ,  H01L23/373 ,  H01L23/31

CPC分类号： H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/0612 ,  H01L2224/06505 ,  H01L2224/14104 ,  H01L2224/145 ,  H01L2224/1451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4912 ,  H01L2224/495 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： [Object] A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution] A semiconductor device includes: a die pad 11 which has a die pad main surface 111 and a die pad rear surface 112; a semiconductor chip 41 mounted on the die pad main surface 111; a sealing resin portion 7 formed with a recess 75 for exposure of the die pad rear surface 11 and covering the die pad 11 and the semiconductor chip 41; and a heat releasing layer 6 disposed in the recess 75. The recess 75 has a recess groove 753 outside the die pad 11 in a direction in which the die pad rear surface 112 extends, and the recess groove 753 is closer to the die pad main surface 111 than to the die pad rear surface 112. The heat releasing layer 6 has a junction layer which is in contact with the die pad rear surface 112 and having part thereof filling the recess groove 753.