Invention Application
- Patent Title: FIN-TYPE FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF
-
Application No.: US15054086Application Date: 2016-02-25
-
Publication No.: US20170250280A1Publication Date: 2017-08-31
- Inventor: Cheng-Ta Wu , Yung-Yu Wang , Yung-Hsiang Chan , Chia-Ying Tsai , Ting-Chun Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L27/088 ; H01L21/02

Abstract:
A fin-type field effect transistor comprising a substrate, at least one gate structure, spacers and strained source and drain regions is described. The at least one gate structure is disposed over the substrate and on the isolation structures. The spacers are disposed on sidewalls of the at least one gate structure. First blocking material layers are disposed on the spacers. The strained source and drain regions are disposed at two opposite sides of the at least one gate structure. Second blocking material layers are disposed on the strained source and drain regions. The first and second blocking material layers comprise oxygen-rich oxide materials.
Public/Granted literature
- US10026838B2 Fin-type field effect transistor and manufacturing method thereof Public/Granted day:2018-07-17
Information query
IPC分类: