Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE WITH SIDEWALL-PROTECTED RDL INTERPOSER
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Application No.: US15296058Application Date: 2016-10-18
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Publication No.: US20170263469A1Publication Date: 2017-09-14
- Inventor: Shing-Yih Shih , Tieh-Chiang Wu
- Applicant: Micron Technology, Inc.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L21/56 ; H01L23/498
Abstract:
A semiconductor package includes a redistribution layer (RDL) interposer having a first side, a second side opposite to the first side, and a vertical sidewall extending between the first side and the second side; at least one semiconductor die mounted on the first side of the RDL interposer; a molding compound disposed on the first side and covering the at least one semiconductor die and the vertical sidewall of the RDL interposer; and a plurality of solder bumps or solder balls mounted on the second side of the RDL interposer.
Public/Granted literature
- US09786514B2 Semiconductor package with sidewall-protected RDL interposer Public/Granted day:2017-10-10
Information query
IPC分类:
