- 专利标题： PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND OLED DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
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申请号： US15502390申请日： 2016-08-17
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公开(公告)号： US20170278897A1公开(公告)日： 2017-09-28
- 发明人: Ning AO , Luopeng CHUO , Chonkyu MIN , Jin XU
- 申请人： BOE TECHNOLOGY GROUP CO., LTD. , ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- 申请人地址： CN Beijing CN Ordos, Inner Mongolia
- 专利权人： BOE Technology Group Co., Ltd.,Ordos Yuansheng Optoelectronics Co., Ltd.
- 当前专利权人： BOE Technology Group Co., Ltd.,Ordos Yuansheng Optoelectronics Co., Ltd.
- 当前专利权人地址： CN Beijing CN Ordos, Inner Mongolia
- 优先权： CN201510742598.6 20151104
- 国际申请： PCT/CN2016/095673 WO 20160817
- 主分类号： H01L27/32
- IPC分类号： H01L27/32 ; H01S5/42 ; H01L33/64 ; G09G3/3208 ; H01S5/022
摘要：
A package substrate and a manufacturing method thereof, and an OLED display device and a manufacturing method thereof are provided. The package substrate comprises a base substrate (1), the base substrate (1) includes a bonding region (11) for coating an adhesive. The package substrate further comprises a first barrier wall (2) located on the base substrate (1), and the first barrier wall (2) is arranged along an outer side edge of the bonding region (11).
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