Invention Application
- Patent Title: WIRING BODY, WIRING BOARD, TOUCH SENSOR AND METHOD FOR PRODUCING WIRING BODY
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Application No.: US15508310Application Date: 2015-12-25
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Publication No.: US20170285786A1Publication Date: 2017-10-05
- Inventor: Takaharu Hondo
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2014-264492 20141226
- International Application: PCT/JP2015/086271 WO 20151225
- Main IPC: G06F3/041
- IPC: G06F3/041 ; H05K3/20
Abstract:
A wiring body includes an adhesive :layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.
Public/Granted literature
- US10379645B2 Wiring body, wiring board, touch sensor and method for producing wiring body Public/Granted day:2019-08-13
Information query
