Invention Application
- Patent Title: HONEYCOMB STRUCTURE AND METHOD OF MAKING SAME
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Application No.: US15519693Application Date: 2015-01-21
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Publication No.: US20170312823A1Publication Date: 2017-11-02
- Inventor: CHI HAO CHANG , CHIEN-TING LIN , KUAN-TING WU
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX HOUSTON
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX HOUSTON
- International Application: PCT/US2015/012163 WO 20150121
- Main IPC: B22F3/11
- IPC: B22F3/11 ; H05K5/03 ; B22F3/105 ; B33Y80/00 ; H05K5/04 ; B33Y10/00

Abstract:
One example provides a method of manufacturing. The method comprises printing multiple layers comprising a metal material by an additive manufacturing technique, wherein each of the multiple layers comprises an array of cavities each having a cross-section of a polygon; and assembling at least two of the multiple layers to form an article having an array of three-dimensional hollow cells collectively having a honeycomb structure.
Public/Granted literature
- US10537939B2 Method of manufacturing a honeycomb structure for an electronic device Public/Granted day:2020-01-21
Information query