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Patent Agency Ranking
公开(公告)号：US20170312823A1
公开(公告)日：2017-11-02
申请号：US15519693
申请日：2015-01-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHI HAO CHANG , CHIEN-TING LIN , KUAN-TING WU
CPC classification number: B22F3/1115 , A45C2011/002 , A45C2011/003 , B22F3/1055 , B22F2003/1058 , B33Y10/00 , B33Y80/00 , G06F1/1656 , H04M1/185 , H05K5/03 , H05K5/04 , Y02P10/295
Abstract: One example provides a method of manufacturing. The method comprises printing multiple layers comprising a metal material by an additive manufacturing technique, wherein each of the multiple layers comprises an array of cavities each having a cross-section of a polygon; and assembling at least two of the multiple layers to form an article having an array of three-dimensional hollow cells collectively having a honeycomb structure.
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公开(公告)号：US20230211375A1
公开(公告)日：2023-07-06
申请号：US17995877
申请日：2020-04-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHI HAO CHANG , CHIEN-TING LIN , KUAN-TING WU
CPC classification number: C23C28/321 , C23C14/024 , C23C14/34 , C23C14/165 , C23C14/205 , C23C14/58 , C25D11/026 , C25D11/18
Abstract: A coated substrate for an electronic device can include a substrate, a physical vapor deposition layer over the substrate, and an anti-fingerprint layer over the physical vapor deposition layer. The physical vapor deposition layer can include an alloy of gold and platinum. The anti-fingerprint layer can include an ultraviolet radiation-cured polymer mixed with an anti-fingerprint material. The anti-fingerprint material can include a silane, a fluorinated polymer, a hydrophobic polymer, or a combination thereof.
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公开(公告)号：US20180216247A1
公开(公告)日：2018-08-02
申请号：US15747205
申请日：2015-09-11
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHI HAO CHANG , KUAN-TING WU , CHIEN-TING LIN
CPC classification number: C25D11/246 , B05D7/52 , B05D2202/20 , B05D2202/25 , B05D2202/35 , B05D2350/60 , C09D5/00 , C09D5/08 , C09D7/61 , C23C18/1212 , C23C18/1216 , C23C18/122 , C23C18/1245 , C23C18/1254 , C23C22/05 , C23C26/02 , C23C28/32 , C23C28/321 , C23C28/345 , C23C28/3455 , C25D11/026 , C25D11/06 , C25D11/26 , C25D11/30 , C25D11/34
Abstract: Substrates comprising a light metal layer, an oxidized layer formed on the light metal layer, and a polymer hybrid layer formed on the oxidized layer; and methods for forming the substrates are disclosed.
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公开(公告)号：US20160231775A1
公开(公告)日：2016-08-11
申请号：US15021476
申请日：2013-10-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： CHUNG-HUNG HUANG , YU-CHUAN KANG , CHIEN-TING LIN , KUAN-TING WU
CPC classification number: G06F1/1626 , B32B1/02 , B32B15/08 , B32B2250/02 , B32B2255/06 , B32B2255/20 , B32B2457/00 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/10 , C25D11/26 , C25D11/30 , G06F2200/1633 , H04M1/0283
Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.
Abstract translation: 提供了一种将转印膜施加到金属表面的方法。 该方法包括电化学处理金属以形成氧化物层，在其上施加转移膜。
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公开(公告)号：US20180245232A1
公开(公告)日：2018-08-30
申请号：US15758114
申请日：2015-10-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： KUAN-TING WU , CHI-HAO CHANG , CHIEN-TING LIN
CPC classification number: C25D11/16 , C25D3/44 , C25D5/48 , C25D11/024 , C25D11/04
Abstract: A method is provided, in which an aluminum layer is deposited on a metal substrate, wherein, in the depositing process, aluminum powders are added into an aqueous polymer medium to form a suspension, the metal substrate and a counter electrode are immersed in the suspension, and a pulsed current is applied between the metal substrate and the counter electrode; and, the aluminum layer deposited on the metal substrate is anodized.
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