- 专利标题: COMPOSITE ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, BOARD FOR MOUNTING THEREOF, AND PACKAGING UNIT THEREOF
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申请号: US15652999申请日: 2017-07-18
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公开(公告)号: US20170316879A1公开(公告)日: 2017-11-02
- 发明人: Jin Hwan KIM , Dae Bok OH , Jae Young PARK , Ichiro TANAKA , Chang Ho LEE
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2014-0063094 20140526
- 主分类号: H01G2/14
- IPC分类号: H01G2/14 ; H01G2/22 ; H01G4/012 ; H01G4/40 ; H05K1/18 ; H01G2/06 ; H01G4/248 ; H01G4/30 ; H01G4/12 ; H05K1/02 ; H05K3/34
摘要:
A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.
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