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    COMPOSITE ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, BOARD FOR MOUNTING THEREOF, AND PACKAGING UNIT THEREOF
    5.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, BOARD FOR MOUNTING THEREOF, AND PACKAGING UNIT THEREOF 审中-公开
    复合电子元件，其制造方法，用于安装的板及其包装单元

    公开(公告)号：US20150340154A1

    公开(公告)日：2015-11-26

    申请号：US14521116

    申请日：2014-10-22

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Jin Hwan KIM ,  Dae Bok OH ,  Jae Young PARK ,  Ichiro TANAKA ,  Chang Ho LEE

    IPC分类号： H01G2/14 ,  H01G4/12 ,  H05K1/18 ,  H01G4/30 ,  H05K1/11 ,  H01G4/012 ,  H01G4/248

    CPC分类号： H01G2/14 ,  H01G2/06 ,  H01G2/22 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H01G4/40 ,  H05K1/0259 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10636 ,  Y02P70/611

    摘要： A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.

    摘要翻译： 一种由包括电容器的复合体和彼此耦合的静电放电（ESD）保护装置组成的复合电子部件。 电容器包括陶瓷体，其中多个电介质层和内部电极层叠有相应的介电层。 ESD保护装置包括设置在陶瓷体上的第一和第二电极，设置在第一和第二电极之间的放电部分和设置在第一和第二电极和放电部分上的保护层。 输入端子，设置在复合体的第一端面上，并连接到内部电极和第一和第二电极。 一种接地端子，形成在复合体的第二端面上，并连接到内部电极和第一和第二电极。

    ARRAY-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    6.
    发明申请
    ARRAY-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    阵列式多层陶瓷电子元件及其安装板

    公开(公告)号：US20150115893A1

    公开(公告)日：2015-04-30

    申请号：US14262282

    申请日：2014-04-25

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Jae Hoon LEE ,  Dae Bok OH ,  Jae Young PARK

    IPC分类号： H01G4/30 ,  H01G4/228 ,  H01G4/012 ,  H05K1/18 ,  H02J7/00

    CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/385 ,  H05K1/181 ,  H05K2201/10015 ,  Y02P70/611

    摘要： An array-type multilayer ceramic electronic component includes a ceramic body including a plurality of first dielectric layers and a plurality of second dielectric layers, first and second internal electrodes disposed on the first dielectric layers and facing each other, third and fourth internal electrodes disposed on the second dielectric layers and facing each other, a first external electrode disposed on a first end surface of the ceramic body and connected to the first internal electrode, a second external electrode disposed on a first side surface of the ceramic body and connected to the second internal electrode, a third external electrode disposed on a second end surface of the ceramic body and connected to the third internal electrode, and a fourth external electrode disposed on a second side surface of the ceramic body and connected to the fourth internal electrode.

    摘要翻译： 阵列型多层陶瓷电子部件包括陶瓷体，该陶瓷体包括多个第一电介质层和多个第二电介质层，第一和第二内部电极设置在第一电介质层上并面对彼此，第三和第四内部电极设置在 所述第二电介质层彼此面对，设置在所述陶瓷体的第一端面上并连接到所述第一内部电极的第一外部电极，设置在所述陶瓷体的第一侧面上并与所述第二外部电极连接的第二外部电极 内部电极，设置在陶瓷体的第二端面上并连接到第三内部电极的第三外部电极，以及设置在陶瓷体的第二侧面上并连接到第四内部电极的第四外部电极。