Invention Application
- Patent Title: ELECTRONIC SUBSTRATES AND INTERPOSERS MADE FROM NANOPOROUS FILMS
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Application No.: US15499756Application Date: 2017-04-27
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Publication No.: US20170316881A1Publication Date: 2017-11-02
- Inventor: Mark Bachman , Guann-Pyng Li
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Main IPC: H01G4/10
- IPC: H01G4/10 ; H01L29/06 ; H01L23/50 ; H01L23/64
Abstract:
An electronic substrate or interposer comprising nanoporous films, such as anodic aluminum oxide, containing vertically etched openings (“vias”) that are filled with a conductive material, forming a high density collection of vertically oriented vias that conduct electricity from one side of the substrate to the other.
Public/Granted literature
- US10553358B2 Electronic substrates and interposers made from nanoporous films Public/Granted day:2020-02-04
Information query
