Embodiments of the present invention provide a microphone, including: a metal cover and a printed circuit board PCB that is connected to the metal cover and that is provided with a sound pickup hole, and further including a boss that is provided with a through hole, where the boss is disposed on a side, away from the metal cover, of the PCB, and the boss is located on a soldering pad surrounding the sound pickup hole, so as to prevent soldering tin and a solder flux from entering the sound pickup hole, and the through hole is in communication with the sound pickup hole, so that an audio signal enters the sound pickup hole through the through hole.