Invention Application
- Patent Title: APPARATUS AND METHOD FOR CONFIGURING A VERTICAL INTERCONNECTION ACCESS AND A PAD ON A 3D PRINTED CIRCUIT UTILIZING A PIN
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Application No.: US15618256Application Date: 2017-06-09
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Publication No.: US20170359896A1Publication Date: 2017-12-14
- Inventor: Chi Yen Kim , Ryan Wicker , Eric MacDonald , David Espalin
- Applicant: Board of Regents, The University of Texas System
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01R12/57 ; H05K3/40 ; H05K3/10
Abstract:
A 3D printed circuit apparatus includes a 3D printed circuit having a surface layer and one or more wires embedded under the surface layer, and a conductive metal pin that is cut to a desired length and inserted into the 3D printed circuit in order to attain contact with the wire or wires embedded under the surface layer.
Information query
