Invention Application
- Patent Title: POLYMER BONDING WITH IMPROVED STEP COVERAGE
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Application No.: US15620064Application Date: 2017-06-12
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Publication No.: US20170365554A1Publication Date: 2017-12-21
- Inventor: Bradley Paul Barber , Kezia Cheng
- Applicant: SKYWORKS SOLUTIONS, INC.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H05K5/00 ; H05K5/06 ; H05K5/02 ; H05K5/03
Abstract:
A system and method for packaging an electronic device are provided. The packaged electronic device may include a structure material having one portion with a first lateral cross-section, and at least one other portion with a second lateral cross-section, where at least one of a dimension and a shape of the second lateral cross-section is different than in the first lateral cross-section.
Information query
IPC分类:
