Invention Application
- Patent Title: FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME
-
Application No.: US15465146Application Date: 2017-03-21
-
Publication No.: US20170372992A1Publication Date: 2017-12-28
- Inventor: Yechung CHUNG , Woonbae KIM , Soyoung LIM , Jeong-Kyu HA
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2016-0079518 20160624
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00

Abstract:
In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the first surface and the second surface, and the first plurality of pads is arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction. At least one merge line is electrically connecting at least two of the first plurality of pads.
Public/Granted literature
- US10304764B2 Film product, film packages and package modules using the same Public/Granted day:2019-05-28
Information query
IPC分类: